Encapsulation method for light emitting diode

Abstract

The invention relates to an encapsulation method used for a light emitting diode. The method includes the following steps: 1) producing a base layer having a special curved inner surface and a "concave" structure; 2) immersing the base layer in a silylating agent for performing silanization treatment to form a silane layer on the surface of the base layer; 3) performing electroplating on a specialcurved surface having the silane layer to form a metal reflecting layer; 4) mounting a first electrode and a second electrode on the silane layer, and an insulating material between the two electrodes; 5) electrically connecting a chip of the light emitting diode to the electrode; and 6) installing a reflection cup on the electrodes, filling the reflection cup is filled with an inert gas, and performing encapsulation by a dispensing mode. The encapsulation method is simple in preparation process, is mild and pollution-free in reaction condition, and is good in process reproducibility; and through a special base layer design and the curved concave surface with the metal reflecting layer, a light emergent surface of the diode can be utilized to an extreme to achieve improvement of the luminous efficiency.

Description

technical field [0001] The invention relates to the manufacture of semiconductor packaging, in particular to a packaging method for light emitting diodes. Background technique [0002] As a commonly used inorganic semiconductor material, light-emitting diode (LED) has been widely used in many fields such as equipment display and functional lighting by virtue of its small size, light weight and high luminous efficiency. Before being applied to specific fields, light-emitting diodes need to be packaged to protect the diode chip, so as to obtain higher luminous efficiency and service life. Although light-emitting diodes have been commercialized and widely used in backlighting and general lighting, the improvement of light output efficiency is still a necessary condition to further reduce the cost while expanding its application range. [0003] Generally, the bases of light-emitting diodes are flat, and the lens is made by injection molding or dispensing to cover the periphery ...

AI Technical Summary

Problems solved by technology

[0003] Generally, the base of light-emitting diodes is flat, and the lens is made by injection molding or dispensing to cover the periphery of the diode. This makes the incident angle of the light-emitting surface of the diode larger, and total reflection is prone to occur. It is difficult to achieve the maximum luminous efficiency in the case of

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