A panel detection device and detection method

Abstract

The invention discloses a panel detection device and a detection method, belonging to the field of liquid crystal display detection, comprising a signal transmitting device, a signal receiving device and a control circuit connecting the signal transmitting device and the signal receiving device, and the panel detection device also includes a voltage output device , the voltage output device is connected to the control circuit, before the signal transmitting and signal receiving device transmits the detection signal, the voltage output device first outputs a high voltage to the metal wire in the panel to be detected, and the weak broken wire and weak short wire, Burn broken wires and short wires directly, and then transmit the detection signal through the signal transmitting device and the signal receiving device to complete the defective detection. Using the technical solution of the present invention for panel detection can improve the detection efficiency, increase the production cycle, and increase the detection rate of defective products , to prevent the waste of cost caused by the flow of defective products.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to a panel detection device and a detection method. Background technique [0002] In the process flow of the liquid crystal display panel, the array substrate needs to be continuously coated and etched. During the etching process, problems such as over-etching or incomplete etching may occur. When forming the metal lines of the array substrate, over-etching Incomplete engraving or etching will lead to poor display on the array substrate, which often manifests as poor cross-shaped lines. More than 90% of the cross-line defects are formed before the source and drain layers, and 60% of the cross-line defects are formed before the source and drain layers. The poor crossing line is due to the weak short circuit and weak open circuit of the metal line caused by over etching and incomplete etching. [0003] At present, there are two detection methods for weak short circuit ...

AI Technical Summary

Problems solved by technology

[0002] In the process flow of the liquid crystal display panel, the array substrate needs to be continuously coated and etched. During the etching process, problems such as over-etching or incomplete etching may occur. When forming the metal lines of the array substrate, over-etching Incomplete engraving or etching will lead to poor display on the array substrate, which often manifests as poor cross-shaped lines. More than 90% of the cross-line defects are formed before the source and drain layers, and 60% of the cross-line defects are formed before the source and drain layers. Poor crossing lines are caused by weak short circuit and weak open circuit of metal lines caused by over etching and incomplete etching

[0003] At present, there are two detection methods for weak short circuit and weak open circuit. One is contact detection. In order to realize the detection of bad cross lines, contact detection needs to make lead wires around the metal wires of the panel to be detected. For Some products without lead-out wires need to be made separately, and need to be removed separately after the test is completed, which wastes the process and time. During the test process, the contact signal transmitter device needs to contact the metal wires one by one. The test process is long and the operation is difficult.

The other is non-contact detection. This method can quickly detect open circuit and short circuit abnormalities of the metal wires in the panel. Since the non-contact signal transmitter cannot transmit high-voltage driving voltage through the air, it cannot detect weak open circuit and weak short circuit. Abnormal, so it will cause certain defective products to flow with the process flow, resulting in the waste of subsequent materials and rising costs. Since the test signal and driving voltage need to be transmitted through the non-contact signal transmitter device, the non-contact signal transmitter device must be connected with the metal The line distance is very close, often around 150um. During the production process, the non-contact signal transmitter will scratch the metal line.

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