Mask Exposure Control Method

An exposure control and photomask technology, which is used in microlithography exposure equipment, photolithography process exposure devices, etc., can solve the problem of inability to meet the irregular imposition exposure processing of various types of photomasks, and achieves simple and easy operation of graphics processing, reducing The effect of small number of mold sets, improving production efficiency and yield

Active Publication Date: 2021-02-09
SHENZHEN NEWWAY PHOTOMASK MAKING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] At present, large-size high-resolution TFT LCD and AMOLED photomask manufacturing equipment have their own mura control function. It only needs to find an optimal mura control parameter through testing according to the pitch value of the photomask pattern; When exposing the official photomask product, the corresponding parameters can be set to achieve the purpose of optimizing mura; however, the existing equipment can only be used for graphics with a single type of full-page and regular layout; even The current state-of-the-art lithography equipment can only aim at regular typesetting masks. According to the spacing value of the graphics in the unit and the spacing value between units, a set of optimal mura control parameters can be determined through testing to achieve effective exposure. Processing, for the multi-variety random mixed-arrangement photomask, there is nothing to do, and it cannot meet the actual needs of multi-variety photomask random imposition exposure processing

Method used

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  • Mask Exposure Control Method
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Embodiment Construction

[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following exemplary embodiments and descriptions are only used to explain the present invention, not as a limitation to the present invention, and, in the case of no conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other .

[0023] Such as image 3 As shown, the embodiment of the present invention provides a mask exposure control method, including the following steps:

[0024] Step S1, obtaining the full-page graphics of the multi-variety random mixed layout of the photomask;

[0025] Step S2, analyzing the full-page graphics, dividing the full-page graphics into several graphic areas and common information areas, graphics with the same typesetting rules are divided into the same graphic area, and the common information area contains the s...

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Abstract

The embodiment of the present invention relates to a photomask exposure control method, including: obtaining the full-page graphics of a multi-variety random mixed typesetting photomask; analyzing the full-page graphics, and dividing the full-page graphics into several graphic areas and shared information areas, Graphics with the same typesetting rules are divided into the same graphic area, and the common information area contains graphics of the information shared by the several graphic areas; each graphic area is used as an exposure area, and the shared information area is used alone as an exposure area or Merge the common information area and one of the graphics areas into one exposure area, generate exposure files for each exposure area one by one; determine the mura control parameters applicable to each exposure area; call the exposure files of each exposure area and the corresponding The mura control parameters are used to perform repeated exposure operations on the same blank plate. The embodiment of the present invention can effectively control the occurrence of the mura phenomenon, improve the production efficiency and yield of the photomask, simplify the graphics processing, reduce the number of photomask opening molds, and save costs.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of photomask manufacturing, and in particular, to a method for controlling exposure of a photomask. Background technique [0002] The reason for mura (mura refers to the uneven brightness of the display, causing various traces) on the mask is mainly due to regular uneven lines (uniform difference) or scanning position offset (sweeplength erro) on the mask. Produced by the photolithography machine during the exposure process. [0003] At present, most large-size masks are produced by progressive scanning laser lithography machines, and the main manufacturers are Mycronic mydata in Sweden and Heidelberg in Germany. The mainstream models are LRS series, FPS series and VPG series, and the mura produced by them are regular stripes, and the stripes are all parallel to the exposure direction. [0004] The following takes the FPS series models of Mycronic mydata as an example to analyze the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 杜武兵林伟司继伟
Owner SHENZHEN NEWWAY PHOTOMASK MAKING
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