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Slurry and polishing method

A grinding method and suspension technology, which is applied in chemical instruments and methods, grinding machine tools, grinding devices, etc., can solve the problems of abrasive particle aggregation and increased possibility, and achieve inhibition of aggregation, excellent dispersion stability, and high storage convenience Effect

Active Publication Date: 2019-05-10
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, depending on conditions such as storage time and storage temperature, the possibility of aggregation and sedimentation of abrasive grains increases

Method used

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  • Slurry and polishing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0109] X parts by mass of ultrapure water was put into the container, and 10 parts by mass of ethylene glycol was injected thereinto, followed by stirring. Further, 0.5 parts by mass of 20% by mass colloidal silica (an amount corresponding to 0.1 part by mass as silica particles) was added to obtain a suspension. In addition, X mass parts of the said ultrapure water were calculated and calculated so that the total may be 100 mass parts.

Embodiment 2

[0111] 2.0 parts by mass of glycine and 0.2 parts by mass of benzotriazole were added to the container, and X parts by mass of ultrapure water was injected thereinto, stirred and mixed to dissolve the two components. Next, 1.5 parts by mass of ethylene glycol was added and stirred. Furthermore, 25 mass parts of 20 mass % colloidal silica (an amount corresponding to 5.0 mass parts as silica particles) was added to obtain a suspension. In addition, X mass parts of the said ultrapure water were calculated and calculated so that the total may be 100 mass parts.

Embodiment 3～10 and comparative example 1～13

[0113] About each component shown in Table 1 and Table 2, the same operation as Example 1 was implemented, and the suspension was obtained.

[0114]

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PUM

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Abstract

Provided is a slurry containing abrasive particles, glycol, and water, wherein the average particle size of the abrasive particles is 120 nm or less, and the pH of the slurry is at least 4.0 and lessthan 8.0. Also provided is a polishing method comprising a step for using the slurry to polish a metal.

Description

technical field [0001] The present invention relates to suspensions and milling methods. Background technique [0002] Even when the CMP slurry containing abrasive grains is used with a low content of abrasive grains, it is used as abrasive grains for various reasons such as space-saving storage, reduced transportation costs, and ease of content adjustment. The storage solution with a higher content than that at the time of use is stored, and it may be diluted and used by mixing with a medium (diluent) such as water or other additives during use. At this time, the higher the content of abrasive grains contained in the stock solution during concentration, the higher the concentration effect will be. [0003] As a CMP polishing liquid (CMP polishing liquid for metal) used for polishing metals, if a damascene process is used to embed a substrate to form wiring, for example, polishing for polishing wiring metals (copper, tungsten, cobalt, etc.) is known liquid (hereinafter ref...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24B37/00C09G1/02H01L21/304
CPCB24B37/00C09G1/02B24B37/0056H01L21/3212C09K3/1463H01L21/304C09K3/1409
Inventor 大内真弓
Owner RESONAC CORPORATION