Microchannel heat exchange device based on hollow foam materials and application of microchannel heat exchange device

A technology of heat exchange devices and foam materials, applied in indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of low effective heat exchange area, poor corrosion resistance, complicated preparation process, etc., and increase the contact area of ​​heat exchange , a wide range of types, high heat transfer efficiency

Active Publication Date: 2019-05-14
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a microchannel heat exchange device based on hollow foam material and its application, so as to solve the problems of low effective heat exchange area, poor corrosion resistance and complicated preparation process in the prior art.

Method used

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  • Microchannel heat exchange device based on hollow foam materials and application of microchannel heat exchange device
  • Microchannel heat exchange device based on hollow foam materials and application of microchannel heat exchange device
  • Microchannel heat exchange device based on hollow foam materials and application of microchannel heat exchange device

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application specific Embodiment approach

[0046] In the specific implementation of the microchannel heat exchange device based on hollow foam material and its application, the present invention uses hollow foam materials with different physical / chemical structures and different materials as the materials for the main functional area of ​​heat exchange, and adopts different configurations The fluid inlet port, collecting cavity, fluid-tight barrier layer, hollow foam material microchannel tube wall heat exchange area, design the heat exchange unit assembly of the microchannel heat exchange device based on hollow foam material according to the present invention, and enumerate The specific implementation of the corresponding application is as follows:

[0047] like figure 1 As shown, from the macroscopic appearance, the microchannel heat exchange device uses the hollow foam material with dense microchannel tube wall as the main functional area constituent material, and the hollow foam material as the main core functional...

Embodiment 1

[0063] This embodiment adopts the structural design of the cylindrical heat exchange unit assembly, see the attached Figure 10 . The main heat exchange functional area consists of image 3 The shown physical structure or chemical structure is composed of hollow foam material with isotropic hollow microchannel pipe wall, and the macroscopic dimension of the hollow foam material cylinder is φ300mm, and the height is 600mm. Wherein, a is the cavity of the hollow microchannel; b is the surface of the inner wall of the hollow microchannel; c is the surface of the outer wall of the hollow microchannel. The wall body of the hollow microchannel is made of stainless steel, the outer diameter of the hollow microchannel is 2mm, and the inner diameter is 1mm. The microchannel heat exchange device composed of the heat exchange unit components is used for the condensation of water vapor, the water vapor inlet temperature is 105°C, the water vapor flows in the macroscopic three-dimensiona...

Embodiment 2

[0065] This embodiment adopts the structural design of the cylindrical heat exchange unit assembly, see the attached Figure 10 . The main heat exchange functional area is composed of a hollow foam material, and the structure of the hollow microchannel tube wall of the hollow foam material is as follows: Figure 4 shown. The macroscopic dimensions of the hollow foam cylinder are φ200mm and 400mm high. Wherein, a is the inner cavity of the hollow microchannel; b is the inner wall surface of the hollow microchannel; c is the outer wall surface of the hollow microchannel whose heat exchange area is further increased after surface treatment. The wall body of the hollow microchannel is made of pure copper, and the outer wall surface has a rough surface structure after surface treatment. The rough surface is made of pure copper particles with a particle size of 0.2 mm and sintered by powder. The hollow microchannel has an outer diameter of 3 mm and an inner diameter of 1.5 mm. T...

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Abstract

The invention relates to the field of heat exchange and heat management, in particular to a microchannel heat exchange device based on hollow foam materials and application of the microchannel heat exchange device. A main function area of the microchannel heat exchange device contains the hollow foam materials, and the structure of the materials is macroscopically formed through network construction of three-dimension-communicating supporting frameworks, and each supporting framework is a three-dimension-communicating microchannel with a hollow structure. By adoption of the microchannel heat exchange device based on the hollow foam materials, the macroscopic three-dimension-communicating hole size, the three-dimension-communicating hollow microchannel inner cavity size and the microchannelpipe wall thickness of the main function area can be regulated and controlled. Efficient substance convection and heat transfer are conducted in the macroscopic three-dimension-communicating hole network of the microchannel heat exchange device, a cold phase and a heat phase in the heat exchange process can be effectively isolated through the pipe wall bodies of the hollow microchannels, heat strides across the pipe wall bodies of the hollow microchannels for transfer and exchange, and the unit volume of the heat exchange function area has a large heat exchange area.

Description

technical field [0001] The invention relates to the field of heat exchange and heat management, in particular to a microchannel heat exchange device based on a hollow foam material and its application. Background technique [0002] The heat exchange device is an energy-saving device that realizes heat transfer between materials between two or more fluids at different temperatures. It transfers heat from a fluid with a higher temperature to a fluid with a lower temperature, so that the fluid temperature reaches the process The specified index is to meet the needs of the process conditions, and it is also one of the main equipment to improve energy utilization. The heat exchange device industry involves nearly 30 industries such as HVAC, pressure vessels, reclaimed water treatment equipment, chemical industry, and petroleum, forming an industrial chain with each other. Especially the microchannel heat exchange device, because of its small size, large heat transfer coefficient...

Claims

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Application Information

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IPC IPC(8): F28D21/00
Inventor 张劲松高勇田冲杨振明杨晓丹
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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