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A three-dimensional ultrasonic nano-vibration assisted processing platform

A three-dimensional ultrasonic and auxiliary processing technology, applied in metal processing equipment, fluid using vibration, metal processing mechanical parts, etc., can solve the problems of limited processing fineness, limited processing depth, low processing speed, etc., to improve the first-order inherent frequency, damage prevention, the effect of eliminating bending moments

Inactive Publication Date: 2020-09-22
TIANJIN UNIV
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Problems solved by technology

However, the atomic force microscope is used as a surface measurement and characterization device. When it is directly used in nano-processing, there are some inherent limitations, such as limited processing fineness, which is only at the level of tens of nanometers; limited processing depth, when marking hard materials. When the depth does not exceed tens of nanometers; the processing speed is low
Therefore, the limitation of the processing ability of the nanofabrication method based on the AFM probe limits its processing efficiency and application range.

Method used

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  • A three-dimensional ultrasonic nano-vibration assisted processing platform
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Embodiment Construction

[0019] A three-dimensional ultrasonic nano-vibration assisted processing platform of the present invention will be described in detail below with reference to the embodiments and the accompanying drawings.

[0020] Such as figure 1 , figure 2 As shown, a three-dimensional ultrasonic nano-vibration assisted processing platform of the present invention includes a rectangular body base 1, and an ultrasonic vibration platform 2 is arranged between an upper corner of the rectangular body base 1 and a symmetrical lower corner. , the platform end 2.1 of the ultrasonic vibration platform 2 is embedded in the upper corner, the tail end 2.2 of the ultrasonic vibration platform 2 is connected to the lower corner by a pre-tightening nut 9, and the platform end 2.1 and The rectangular base 1 is an interference fit, and the platform end 2.1 is respectively provided with a group of vibration mechanisms for providing vibration for the ultrasonic vibration platform 2 between the surfaces adj...

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Abstract

The invention discloses a three-dimensional ultrasonic nano vibration auxiliary processing platform. The three-dimensional ultrasonic nano vibration auxiliary processing platform comprises a cuboid base seat, and an ultrasonic vibration platform is arranged between an upper end angle and a lower end angle symmetric with the upper end angle of the cuboid base seat in a penetrating mode; the platform end of the ultrasonic vibration platform is arranged in the upper end angle in an embedded mode, and the tail end of the ultrasonic vibration platform is connected to the lower end angle position through a pretightening nut; and the platform end is in interference fit with the cuboid base seat, sets of vibration mechanisms are correspondingly arranged between the surfaces, adjacent to the cuboidbase seat, of the platform end and the cuboid base seat, and the vibration mechanisms are mutually perpendicular to each other. According to the three-dimensional ultrasonic nano vibration auxiliaryprocessing platform, a single cantilever beam is adopted to perform supporting, the structure is simple and compact, through the interference fit with the cuboid base seat, the first-order inherent frequency of the ultrasonic vibration platform can be effectively improved, and thus the adjustable frequency range of the ultrasonic nano vibration platform auxiliary processing is ensured.

Description

technical field [0001] The invention relates to a processing platform. In particular, it relates to a three-dimensional ultrasonic nano-vibration assisted processing platform. Background technique [0002] With the wide application of nano-devices in aerospace, biomedical, semiconductor and other fields, higher requirements are put forward for the ability of nano-processing. In the field of nano-processing, processing methods such as photolithography processing, electron beam processing, and concentrated ion beam processing are more suitable for mass production of products due to the limitation of instrument cost and processing environment. The nano-scribing processing method based on atomic force microscopy (AFM) probe is more suitable for small batch processing due to its simple principle, easy operation, low instrument cost, and the advantages that it can be realized in a laboratory environment. Sample processing. However, the atomic force microscope is used as a surfa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23Q1/26B06B1/06
Inventor 田延岭卢康康王福军周重凯马越张大卫
Owner TIANJIN UNIV
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