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A kind of solar cell grid material and its manufacturing process

A solar cell and manufacturing process technology, which is applied in manufacturing tools, cable/conductor manufacturing, circuits, etc., can solve the problems of multiple processes and low battery production efficiency, and achieve uniform material distribution, increased production efficiency, and excellent bending fatigue strength Effect

Active Publication Date: 2021-01-22
江苏安澜万锦电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The application number is the document of CN 103390694 A, nickel plating, silver paste screen printing and drying sintering, copper plating, silver plating in sequence, many processes, low battery production efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1) Conduct electroplating treatment on the diameter Φ0.8 copper-silver alloy wire containing 0.3% silver, and the thickness of the nickel plating layer is 22 μm;

[0027] 2) The temperature of the heating furnace is controlled at 490°C during annealing;

[0028] 3) The moving speed of the alloy wire in the metal tube is controlled at 260m / min.

[0029] The nickel-plated copper-silver alloy wire rod that adopts embodiment one preparation is carried out outward appearance, mechanical property and electrical conductivity detection, and result is as follows:

[0030] 1) Elongation: 19%;

[0031] 2) The outer diameter of the bare wire is The thickness of nickel plating layer is 1.3μm;

[0032] 3) The nickel content of the nickel-plated copper-silver alloy wire is 7.35%, and the nickel content of the coating is 99.9%;

[0033] 4) The appearance of the nickel-plated copper-silver alloy wire is uniform, and there are no defects such as cracks, streaks, and voids in the cro...

Embodiment 2

[0037] 1) Conduct electroplating treatment on the diameter Φ0.8 copper-silver alloy wire containing 0.2% silver, and the thickness of the nickel plating layer is 19 μm;

[0038] 2) The temperature of the heating furnace is controlled at 480°C during annealing;

[0039] 3) The moving speed of the alloy wire in the metal tube is controlled at 250m / min.

[0040] The nickel-plated copper-silver alloy wire rod that adopts embodiment two preparation is carried out outward appearance, mechanical property and electrical conductivity detection, and result is as follows:

[0041] 1) Elongation: 18%;

[0042] 2) The outer diameter of the bare wire is The thickness of nickel plating layer is 1.27μm;

[0043] 3) The nickel content of the nickel-plated copper-silver alloy wire is 7.3%, and the nickel content of the coating is 99.9%;

[0044] 4) The appearance of the nickel-plated copper-silver alloy wire is uniform, and there are no defects such as cracks, streaks, and voids in the cro...

Embodiment 3

[0048] 1) Conduct electroplating treatment on the diameter Φ0.8 copper-silver alloy wire containing 0.4% silver, and the thickness of the nickel plating layer is 25 μm;

[0049] 2) The temperature of the heating furnace is controlled at 500°C during annealing;

[0050] 3) The moving speed of the alloy wire in the metal tube is controlled at 270m / min.

[0051] The nickel-plated copper-silver alloy wire rod that adopts embodiment two preparation is carried out outward appearance, mechanical property and electrical conductivity detection, and result is as follows:

[0052] 1) Elongation: 19.5%;

[0053] 2) The outer diameter of the bare wire is The thickness of nickel plating layer is 1.35μm;

[0054] 3) The nickel content of the nickel-plated copper-silver alloy wire is 7.5%, and the nickel content of the coating is 99.9%;

[0055] 4) The appearance of the nickel-plated copper-silver alloy wire is uniform, and there are no defects such as cracks, streaks, and voids in the c...

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Abstract

The invention discloses a manufacturing process of a solar cell grid material. The process comprises the steps that a copper-silver alloy wire containing 0.2%-0.4% of silver is electroplated, and thethickness of a nickel plating layer is 19 microns to 25 microns; the nickel-plated copper-silver alloy wire obtained in the first step is subjected to multi-pass rough drawing; the nickel-plated copper-silver alloy wire obtained in the second step is subjected to multi-pass fine drawing; and the nickel-plated copper-silver alloy wire obtained in the third step is subjected to annealing. The grid conductive material alloy wire is separately produced and does not occupy cells, so that the production efficiency is greatly improved. The bending fatigue strength of the grid conductive main body material is better than that of materials described in comparative documents, and the material can be applied to conventional crystalline silicon solar cells and bendable flexible thin film solar cells.

Description

technical field [0001] The invention belongs to the technical field of solar cell grid material preparation, and mainly relates to a process for manufacturing a nickel-plated copper-silver alloy grid material. Background technique [0002] The solar cell production process includes the preparation of the gate, and the selection of the gate material directly affects the preparation process, efficiency and cost of the gate, and ultimately affects the performance and manufacturing cost of the solar cell. Traditional solar cell grids are usually manufactured by silver paste screen printing, but the cost of silver paste for traditional solar cell grid wire electrodes is high, and the cost of screen printing machines is relatively high, which makes the process of preparing silver grid electrodes by screen printing Accounted for a large cost of solar cells. [0003] The document with the application number CN201610963416 uses a fine metal wire coated with a nano-silver film as the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C22F1/08C22F1/02C21D9/52H01B13/00H01B1/02H01L31/0224B21C37/02
Inventor 梁建锋李春涛丁仕燕
Owner 江苏安澜万锦电子股份有限公司