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A method for predicting the fatigue life of a bonding layer of a bonding structure under high-temperature and low-temperature cold and hot circulation conditions

A prediction method and fatigue life technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as high cost, time-consuming, and difficult to directly apply fatigue life testing

Inactive Publication Date: 2019-05-17
BEIHANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, these existing methods mainly use low-temperature media such as liquid nitrogen to obtain low-temperature conditions and electric heating devices to obtain high-temperature conditions, which are not only costly but also extremely time-consuming
Although the accelerated thermal cycle test can more realistically simulate the real working conditions, it is difficult to directly apply the temperature load test and its specific devices to the material space environment, both in terms of cost and difficulty in technical implementation. The fatigue life test under the

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  • A method for predicting the fatigue life of a bonding layer of a bonding structure under high-temperature and low-temperature cold and hot circulation conditions
  • A method for predicting the fatigue life of a bonding layer of a bonding structure under high-temperature and low-temperature cold and hot circulation conditions
  • A method for predicting the fatigue life of a bonding layer of a bonding structure under high-temperature and low-temperature cold and hot circulation conditions

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Embodiment 1

[0033] This embodiment is an aluminum / epoxy adhesive / aluminum bonded structure ( figure 1 a).

[0034] 1. Finite element simulation. According to the above-mentioned implementation mode, the test piece model of the bonded structure is established and a representative volume unit is selected for finite element thermal analysis model, numbered as Model A( figure 1 b). The upper and lower surfaces of the model are aluminum plates, and the middle layer is epoxy adhesive. The dark color in the middle area of ​​the model indicates that the grid is dense, which is the main research area. The parameters of the finite element model are shown in Table 1.

[0035] Table 1 finite element model parameters

[0036] model number

Length, width and height (mm 3 )

Adhesive thickness (μm)

Model A

9*1*0.315

150

[0037] The material parameter input and result output are shown in Table 2 and Table 3, respectively.

[0038] Table 2 Input material paramete...

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Abstract

The invention discloses a method for testing the fatigue life of a bonding layer of a bonding structure under high-temperature and low-temperature cold and hot circulation conditions. The method is characterized by establishing a finite element thermal analysis model of a bonding layer of a bonding structure by utilizing a finite element analysis method; and simulating and calculating the strain response of the bonding layer in the cold and hot circulation process within the temperature interval of-120 DEG C to 120 DEG C, obtaining the maximum strain under the cold and hot circulation condition through an in-situ strain test, and verifying the finite element model result of the bonding layer. On the basis of the finite element analysis and the in-situ test results, the maximum thermal stress of the bonding layer of the bonding structure in a given temperature range is determined, so that the temperature load of the test piece in the cold and hot circulation process is converted into the mechanical stress load. And finally, through a fatigue performance test under an equivalent mechanical load, the fatigue life of the structural part bonding layer under high and low temperature coldand hot circulation is predicted quickly with low cost and high accuracy.

Description

technical field [0001] The invention relates to the field of fatigue life testing of adhesive layers, in particular to a method for predicting the fatigue life of an adhesive layer of an adhesive bonded structure under high and low temperature cycle conditions. Background technique [0002] Long-term service spacecraft in the space environment need to repeatedly enter and exit the earth's shadow during low-earth orbit operation, and will encounter alternating changes in ambient temperature between -170°C and 200°C during orbital operation. For a bonded structure composed of multiple materials with different thermal expansion coefficients, since each material component in the bonded structure will be bound to each other to a certain extent through the bonded interface, after long-term thermal cycle effects will inevitably Thermal stresses are generated inside the bonded structure. The long-term effect of this thermal stress will lead to micro-cracks inside the bonded structu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 杨继萍李红张博明李大海苏航
Owner BEIHANG UNIV
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