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Edge cutting method and device of packaging substrate

A technology for encapsulating substrates and cutting edges, which is applied to positioning devices, large fixed members, clamping, etc., can solve problems such as increased production turnaround time, difficulty in tearing copper foil from boards, and decreased quality of boards, so as to reduce the number of transfer boards Effects of piece action, removal of work convenience, reduction of cost and quality problems

Inactive Publication Date: 2019-05-21
WUXI SHENNAN CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this milling positioning method has the disadvantages of increasing the production turnaround time and increasing the production cost due to the many processes, and this positioning method will leave a plurality of positioning holes on the plate, and these Holes will make it difficult to tear off the copper foil later on the board, and frequent problems such as local deformation and breakage of the board will cause the quality of the board to decline

Method used

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  • Edge cutting method and device of packaging substrate
  • Edge cutting method and device of packaging substrate
  • Edge cutting method and device of packaging substrate

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0029] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses an edge cutting method and device of a packaging substrate. The edge cutting method of the packaging substrate comprises the following steps of S1, controlling the X-ray equipment perspective packaging substrate, and acquiring the position of an inner target; S2, acquiring the theoretical position of the packaging substrate based on the position of the inner target; S3, controlling a workbench to position and fix the packaging substrate; S4, controlling the packaging substrate to be adjusted to a required edge cutting position according to the theoretical position; andS5, controlling an edge milling machine to work so as to carry out edge cutting on burrs of the packaging substrate. By means of the technical scheme of the edge cutting method and device, the cost and quality problems in the production process of the packaging substrate can be reduced.

Description

technical field [0001] The invention relates to the technical field of electronic circuit boards, in particular to a method and device for cutting edges of packaging substrates. Background technique [0002] In the production process of packaging substrates, it is necessary to produce multilayer boards by lamination, that is, lamination, and the board edges of the laminated multilayer boards are usually in the state of burrs, which need to be deburred. The current traditional process for removing burrs is as follows: First, after the lamination process, the multilayer board is placed on the workbench; then, the supporting X-ray equipment first sees through the x-ray (x-ray) The image of the inner layer, and grab and drill the inner layer target inside the multi-layer board through the x-ray drilling target; finally, after the matching edge milling machine is drilled through the x-ray drilling target for hole positioning, Manual edge milling is then performed to remove burrs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23C3/12B23Q1/25B23Q3/08B26D7/20B26D7/01B26D1/12
Inventor 杨平宇杨智勤徐永斌张建
Owner WUXI SHENNAN CIRCUITS CO LTD
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