Unlock instant, AI-driven research and patent intelligence for your innovation.

A reflow oven stability detection device and detection method

A technology of reflow soldering furnace and detection device, which is applied in the direction of measuring device, auxiliary device, heat measurement, etc., can solve the problems of material consumption, inability to detect multiple times, and high detection cost, so as to reduce detection cost, improve accuracy, and improve the testing process. simple effect

Active Publication Date: 2021-08-17
XIAMEN HI BIT ELECTRONICS
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, samples usually use soldered circuit boards, which consume more materials, and usually cannot be tested multiple times, resulting in higher testing costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A reflow oven stability detection device and detection method
  • A reflow oven stability detection device and detection method
  • A reflow oven stability detection device and detection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A reflow oven stability detection device, such as figure 1 As shown, it includes a positioning plate 1, a test piece 2 arranged on the positioning plate 1, and a temperature detector 3 connected to the test piece 2. The temperature detector 3 is connected to the test piece 2 through the test wiring 4, and the test wiring 4 adopts a weldable Made of copper wire or aluminum wire, the test wire 4 is welded to the test piece 2, so that the temperature during welding is detected by the temperature detector 3.

[0050] Such as figure 1 and image 3 As shown, the test piece 2 specifically includes a mounting piece 21 installed on the positioning plate 1 and a welding portion 22 arranged at one end of the mounting piece 21, wherein the welding portion 22 is provided with a plurality of welding points 221, and the welding points 221 are used to match the circuit board. The welding place is made of the same material, and the test wiring 4 is welded on the welding point 221 to i...

Embodiment 2

[0058] A method for detecting the stability of a reflow oven, such as figure 1 As shown, the reflow oven stability detection device in Embodiment 1 is used to detect;

[0059] Step 1. Measure the air temperature in the reflow oven according to the detection system of the reflow oven itself and form an air flow temperature curve, and adjust the welding temperature of the reflow oven to the required welding temperature; in this step, according to the circuit board Adjust the welding temperature according to the welding requirements to improve the production accuracy of the circuit board;

[0060] Step 2, put the reflow oven stability detection device into the conveyor belt of the reflow oven for transport, and use the temperature detector 3 to test the temperature of the reflow oven at the soldering point in real time and form an initial temperature curve; in this step The test value is input to the computer for saving and analysis, so as to facilitate analysis and comparison l...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a reflow soldering furnace stability detection device, which relates to the technical field of reflow soldering furnace detection. The key points of the technical solution are: comprising a positioning plate, a test piece arranged on the positioning plate, and a temperature detector connected to the test piece, The test piece includes a mounting piece installed on the positioning plate and a welding part arranged at one end of the mounting piece, the welding part is provided with a plurality of welding points, and the test piece is connected to the temperature detector by a test wire. One end of the test wire is connected to the welding point, and the other end is connected to the temperature detector. Solder at the soldering point through the test wiring, the soldering temperature is measured by the temperature detector during soldering, and then other soldering points can be used for soldering tests to realize the use of multiple soldering tests without using the soldered circuit board. Test, reduce material waste, and achieve the effect of reducing testing costs.

Description

technical field [0001] The invention relates to the technical field of reflow soldering furnace detection, and more specifically, it relates to a reflow soldering furnace stability detection device and detection method. Background technique [0002] SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation of Surface Mount Technology), known as surface mount or surface mount technology, which is currently the most popular technology and process in the electronics assembly industry. It is a kind of non-lead or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface of the printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, through Circuit assembly and connection technology that is soldered and assembled by methods such as reflow soldering or dip soldering. In the prior art, a hot air reflow oven is usually used to process it. Whether the temperature curve of the solder jo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00B23K3/08G01K13/00G01K1/14
Inventor 陈世友李明志黄瑞霞
Owner XIAMEN HI BIT ELECTRONICS