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Manufacturing method of semiconductor device and semiconductor processing system

A semiconductor and device technology, applied in the field of semiconductor processing systems, which can solve problems such as by-product generation

Active Publication Date: 2021-08-06
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

During photolithography processing, by-products may be generated after the photoresist material is formed and removed

Method used

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  • Manufacturing method of semiconductor device and semiconductor processing system
  • Manufacturing method of semiconductor device and semiconductor processing system
  • Manufacturing method of semiconductor device and semiconductor processing system

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Embodiment Construction

[0063] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include that additional features may be formed on An embodiment in which the first feature and the second feature are in such a way that the first feature and the second feature may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configu...

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Abstract

The present invention provides a method of manufacturing a semiconductor device and a semiconductor processing system. The method includes the following steps. A photoresist layer is formed on the substrate in a lithography tool. The photoresist layer is exposed in a photolithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed by using a developer to form a patterned photoresist layer in a photolithography tool. The ammonia by-product of the developer is removed from the lithography tool.

Description

technical field [0001] Embodiments of the present invention relate to a method for manufacturing a semiconductor device and a semiconductor processing system. Background technique [0002] Semiconductor devices are widely used in various electronic applications such as personal computers, cellular telephones, digital cameras, and other electronic equipment (as examples). Photolithography is one of the important techniques commonly used during the fabrication of semiconductor devices. During photolithography processing, by-products may be generated after the photoresist material is formed and removed. Contents of the invention [0003] Embodiments of the present invention include a method of manufacturing a semiconductor device as follows. In a lithography tool, a photoresist layer is formed on a substrate. The photoresist layer is exposed in a photolithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed by using a developer to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCH01L21/67017H01L29/78G03F7/3092G03F7/0046G03F7/0392H01L21/0273H01L22/12G03F7/32G03F7/20H01L21/67242G03F7/039G03F7/322G03F7/40H01L21/0274H01L22/10H01L29/66568H01L21/67253G03F7/16
Inventor 陈裕凯钟佳宏高克斌叶书佑吴立仁柯智佑林明鸿
Owner TAIWAN SEMICON MFG CO LTD