Circuit substrates with electronic elements, and manufacturing method thereof

Abstract

The invention provides circuit substrates with electronic elements, and a manufacturing method thereof. The manufacturing method of the circuit substrates with the electronic elements comprises the following steps: providing a stainless steel substrate, wherein the stainless steel substrate is provided with a first surface and a second surface which are opposite to each other, at least one first groove located on the first surface, and at least one second groove located on the second surface; forming a first metal layer and a second metal layer on the stainless steel substrate; respectively arranging at least one first electronic element and at least one second electronic element in the first groove and the second groove; respectively forming a first insulation layer and a second insulation layer on the first surface and the second surface; respectively forming a first circuit structure and a second circuit structure on the first insulation layer and the second insulation layer; and separating the stainless steel substrate, the first metal layer and the second metal layer, so that the two circuit substrates, which are respectively provided with the electronic elements and are separated from each other, can be formed.

Description

technical field [0001] The invention relates to a circuit substrate containing electronic components and its production, and in particular to a circuit substrate containing electronic components whose core base material can be reused and a production method thereof. Background technique [0002] Generally speaking, for circuit substrates with embedded electronic components, the electronic components are embedded in the slots of the core substrate first, and then build-up circuit layers are formed on both sides of the substrate to electrically connect the electronic components in the slots. Using this method to form a circuit substrate with embedded electronic components, the core substrate will eventually become a part of the final product, so the core substrate cannot be reused, and the thickness of the final product is thicker, and more materials are used. Longer makes the cost higher. Contents of the invention [0003] The invention provides a method for manufacturing ...

AI Technical Summary

Problems solved by technology

Using this method to form a circuit substrate with embedded electronic components, the core substrate will eventually become a part of the final product, so the core substrate cannot be reused, and the thickness of the final product is thicker, and more materials are used. Longer makes the cost higher

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