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Filler-containing film

A filler retention and resin layer technology, applied in the direction of film/flaky adhesives, conductive materials dispersed in non-conductive inorganic materials, conductors, etc., can solve the problem of easy movement of conductive particles, inability to separate conductive particles, Problems such as the inability to maintain the precise arrangement of conductive particles, to achieve the effect of improving capture and reducing flow

Active Publication Date: 2019-05-24
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, the anisotropic conductive film described in Patent Document 5 has a problem that conductive particles tend to move during temporary crimping of the anisotropic conductive connection, and the conductive particles before the anisotropic conductive connection cannot be maintained after the anisotropic conductive connection. precision configuration, or the distance between conductive particles cannot be sufficiently separated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~11、 comparative example 1~2

[0187] (1) Manufacture of anisotropic conductive film

[0188] According to the blends shown in Table 1, resin compositions for forming the insulating resin layer and the second insulating resin layer were prepared, respectively.

[0189] Using a bar coater at a film thickness of 50 mu The resin composition to form the insulating resin layer was coated on the PET film of m, and dried in an oven at 80° C. for 5 minutes to form an insulating resin layer with the thickness shown in Table 2 on the PET film. In the same manner, a second insulating resin layer was formed on the PET film with the thickness shown in Table 2.

[0190] [Table 1]

[0191]

[0192] On the other hand, a mold is made so that the conductive particle 1 is Figure 1A The distance between the particles in the square lattice arrangement shown is equal to the particle size of the conductive particles, and the number density of the conductive particles reaches 28000 / mm 2 . That is, make a mold, the convex...

experiment example 1~4

[0246] (Production of anisotropic conductive film)

[0247] For the anisotropic conductive film used for COG connection, in order to study the influence of the resin composition of the insulating resin layer on the film-forming ability and conduction characteristics, the blends shown in Table 3 were prepared to form the insulating resin layer and the second A resin composition for two insulating resin layers. In this case, the minimum melt viscosity of the resin composition is adjusted according to the preparation conditions of the insulating resin composition. Using the obtained resin composition, the same operation as in Example 1 was performed to form an insulating resin layer, and an anisotropic conductive film composed of a single layer of a conductive particle dispersion layer was produced by pressing conductive particles into the insulating resin layer. , and a second insulating resin layer was laminated on the side of the insulating resin layer into which the conducti...

experiment example 5~8

[0265] (Production of anisotropic conductive film)

[0266] For the anisotropic conductive film used for FOG connection, in order to study the influence of the resin composition of the insulating resin layer on the film-forming ability and conduction characteristics, an insulating resin layer and a second A resin composition for an insulating resin layer. In this case, the arrangement of conductive particles is set to a number density of 15,000 / mm 2 arranged in a hexagonal lattice with one of its lattice axes inclined at 15° with respect to the long side direction of the anisotropic conductive film. In addition, the minimum melt viscosity of the resin composition is adjusted according to the preparation conditions of the insulating resin composition. Using the obtained resin composition, the same operation as in Example 1 was performed to form an insulating resin layer, and an anisotropic conductive film composed of a single layer of a conductive particle dispersion layer wa...

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Abstract

A filler-containing film which comprises a resin layer and a filler dispersed in the resin layer. The filler-containing film, when press-bonded to an article, is inhibited from suffering an unnecessary filler flow caused by an unnecessary flow of the resin layer. The filler-containing film 10A comprises a filler dispersion layer 3 in which particles of a filler 1 have been dispersed in a resin layer 2. In the filler dispersion layer 3, the surface of the resin layer in the vicinity of each particle of the filler 1 has an inclination 2b or protrusion 2c relative to the tangential plane 2p of portions of the resin layer which are intermediate between the adjacent filler particles. This filler 1 has a CV value concerning particle diameter of 20% or less.

Description

technical field [0001] This invention relates to filled films. Background technique [0002] Filler-containing films in which fillers are dispersed in the resin layer are used in various applications such as matting films, capacitor films, optical films, label films, antistatic films, and anisotropic conductive films (Patent Document 1, Patent Document 2, Patent Document 3, Patent Document 4). From the viewpoint of optical properties, mechanical properties, or electrical properties, it is desirable to suppress unnecessary resin flow of the resin that forms the filler-containing film when the filler-containing film is thermocompression-bonded to an article to be adhered to the filler-containing film, Thereby suppressing the segregated presence of the filler. In particular, when the filler-containing film is made into an anisotropic conductive film for mounting electronic components such as IC chips by containing conductive particles as a filler, if the conductive particles ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B32B27/00H01B1/22H01B5/16H01R11/01H01R43/00
CPCH01B1/22H01B5/16C08J5/18C08J7/042C08J7/044C08J2363/00C08J2463/00H01B1/20C09J7/22B32B27/20C08K2201/001B32B27/18H01R11/01H01R43/00
Inventor 塚尾怜司
Owner DEXERIALS CORP