Filler-containing film
A filler retention and resin layer technology, applied in the direction of film/flaky adhesives, conductive materials dispersed in non-conductive inorganic materials, conductors, etc., can solve the problem of easy movement of conductive particles, inability to separate conductive particles, Problems such as the inability to maintain the precise arrangement of conductive particles, to achieve the effect of improving capture and reducing flow
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1~11、 comparative example 1~2
[0187] (1) Manufacture of anisotropic conductive film
[0188] According to the blends shown in Table 1, resin compositions for forming the insulating resin layer and the second insulating resin layer were prepared, respectively.
[0189] Using a bar coater at a film thickness of 50 mu The resin composition to form the insulating resin layer was coated on the PET film of m, and dried in an oven at 80° C. for 5 minutes to form an insulating resin layer with the thickness shown in Table 2 on the PET film. In the same manner, a second insulating resin layer was formed on the PET film with the thickness shown in Table 2.
[0190] [Table 1]
[0191]
[0192] On the other hand, a mold is made so that the conductive particle 1 is Figure 1A The distance between the particles in the square lattice arrangement shown is equal to the particle size of the conductive particles, and the number density of the conductive particles reaches 28000 / mm 2 . That is, make a mold, the convex...
experiment example 1~4
[0246] (Production of anisotropic conductive film)
[0247] For the anisotropic conductive film used for COG connection, in order to study the influence of the resin composition of the insulating resin layer on the film-forming ability and conduction characteristics, the blends shown in Table 3 were prepared to form the insulating resin layer and the second A resin composition for two insulating resin layers. In this case, the minimum melt viscosity of the resin composition is adjusted according to the preparation conditions of the insulating resin composition. Using the obtained resin composition, the same operation as in Example 1 was performed to form an insulating resin layer, and an anisotropic conductive film composed of a single layer of a conductive particle dispersion layer was produced by pressing conductive particles into the insulating resin layer. , and a second insulating resin layer was laminated on the side of the insulating resin layer into which the conducti...
experiment example 5~8
[0265] (Production of anisotropic conductive film)
[0266] For the anisotropic conductive film used for FOG connection, in order to study the influence of the resin composition of the insulating resin layer on the film-forming ability and conduction characteristics, an insulating resin layer and a second A resin composition for an insulating resin layer. In this case, the arrangement of conductive particles is set to a number density of 15,000 / mm 2 arranged in a hexagonal lattice with one of its lattice axes inclined at 15° with respect to the long side direction of the anisotropic conductive film. In addition, the minimum melt viscosity of the resin composition is adjusted according to the preparation conditions of the insulating resin composition. Using the obtained resin composition, the same operation as in Example 1 was performed to form an insulating resin layer, and an anisotropic conductive film composed of a single layer of a conductive particle dispersion layer wa...
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle diameter | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


