Electromagnetic pulse welding system dedicated to pcb board welding

Abstract

The invention discloses an electromagnetic pulse welding system specially used for PCB board welding, including a bearing base for placing a PCB board to be welded, an electromagnetic pulse welding assembly, and a shielding mold; the electromagnetic pulse welding assembly includes a pulse power supply, a coil, a flat magnetic collector, and a coil It is located above the flat magnetic collector and connected to the pulse power supply. The electromagnetic pulse welding assembly is set above the bearing base through the mounting bracket on the bearing base; the shielding mold is used to cover the back of the PCB board, made of non-conductive material, and the whole is a box cover that can cover the bottom opening of the PCB board. There are a number of unshielded wall passages vertically penetrating the box cover, and the unshielded passages correspond to the solder points on the back of the PCB board to be welded.

Description

Technical field[0001]The present invention relates to the field of electromagnetic pulse welding technologies, and in particular to systems that have been welded to be welded using electromagnetic pulse welding techniques.Background technique[0002]The production process of the PCB is, first designing the drawings, then print the drawing to the printed circuit board, a pad of solder joints and molding circuits, and mounting the electronic components on the pad and connected to the pad. A conventional welding method, on the back side of the printed circuit board, a two-dimensional array is arranged on a spherical pad, and a hole inserted on the printed circuit substrate, the element is inserted into the hole, the pin and the solder joint of the printed circuit. Welding, such as gate array packages, use this method.[0003]And existing package welding techniques, whether the connection of the element pin and the printed circuit substrate is basically adopted by solder connection, and the...

AI Technical Summary

Problems solved by technology

There are many welding steps, so it is necessary to ensure that each step is qualified for product quality. At the same time, there are multiple solder joints and multiple electronic components on the printed circuit board, so multiple soldering is required

At the same time, soldering is used, because flux, solder, etc. will be introduced, so it is easy to cause the surface of the chip to be unclean, and additional cleaning steps are often required

[0004] Furthermore, the failure of electronic equipment is often caused by various problems in the soldering process, such as: the pressure welding is too heavy, causing the welding place to break; the pressure welding is too light or the surface of the chip is not clean, resulting in false welding Falling off; intermetallic compounds, such as Au-Al, may form Au at the soldering place 2 Al, AuAl, AuAl 2 、Au 4 Al, Au 5 Al, etc., have different lattice constants and expansion coefficients, and lower conductivity, resulting in reduced bonding strength and increased contact resistance, leading to device performance degradation or failure.

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