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Method and display for massive transfer of miniature light-emitting diodes

A technology of light-emitting diodes and a transfer method, which is applied in the field of mass transfer of micro-light-emitting diodes and displays, can solve the problems of high manufacturing cost and large consumables, and achieve the effects of simple manufacturing process, reduced manufacturing cost, and strong operability

Active Publication Date: 2020-10-02
NANJING CEC PANDA LCD TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The purpose of the present invention is to provide a method for mass transfer of miniature light-emitting diodes, aiming to solve the problems of large consumables and high manufacturing costs in the mass transfer of micro-light-emitting diodes

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  • Method and display for massive transfer of miniature light-emitting diodes
  • Method and display for massive transfer of miniature light-emitting diodes
  • Method and display for massive transfer of miniature light-emitting diodes

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Embodiment Construction

[0048] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0049] A method for mass transfer of miniature light-emitting diodes, comprising the steps of:

[0050] S1: if figure 1As shown, a first epitaxial wafer 3 with a first substrate and a first transient substrate 6 are provided, a first release glue 5 is coated on the first epitaxial wafer 3 and the first epitaxial wafer 3 is passed through the first epitaxial wafer 3 A release adhesive 5 is bonded to the first transient substrate 6; the first epitaxial wafer 3 is peeled o...

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Abstract

The invention provides a micro light-emitting diode mass transfer method and a micro light-emitting diode display. A metal layer is formed on a three-color Micro LED array; corresponding bonding metalis formed on the array substrate; and the three-color Micro LEDs are transferred to the array substrate in batches by adopting a metal bonding mode between the three-color Micro LED array and the array substrate. Through forming the metal layer on the three-color Micro LED array, forming the corresponding bonding metal on the array substrate and transferring the three-color Micro LEDs to the array substrate in batches by adopting a metal bonding mode between the three-color Micro LED array and the array substrate, a transfer head is saved, the manufacturing cost of the Micro LED display is reduced, the process is simple and the operability is strong.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation, in particular to a method for mass transfer of micro light emitting diodes and a display. Background technique [0002] Light Emitting Diode (LED for short) is a semiconductor diode that can convert electrical energy into light energy. It has the characteristics of small size, high brightness and low energy consumption, and is widely used in the fields of display and lighting. Micro light-emitting diodes (Micro LEDs for short) are LEDs whose size reaches the micron level. [0003] Micro LED display has the advantages of high efficiency, high brightness, high reliability, energy saving, small size and thickness, and is a new generation of display technology. During the manufacturing process of Micro LED displays, epitaxial wafers need to be fabricated into LEDs one by one through a series of processes, and then transferred to the array substrate. Because the size of Micro LED is extrem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L27/15
Inventor 安金鑫高威朱充沛
Owner NANJING CEC PANDA LCD TECH