A pick-up device with angle adjustment function for chip processing

Abstract

The invention relates to a pick-up device with angle adjustment function for chip processing, comprising a suction nozzle, a fixed pipe, a connecting pipe, an adjustment mechanism and a control mechanism, the fixed pipe and the connecting pipe are coaxially arranged, the fixed pipe The outer diameter of the pipe is smaller than the inner diameter of the connecting pipe. The suction nozzle is installed at one end of the fixed pipe, and the other end of the fixed pipe is connected with the connecting pipe through an adjustment mechanism. The control mechanism is arranged in the connecting pipe. The control mechanism includes a sealing Disk, control components and two limit blocks, the pick-up device with angle adjustment function for chip processing realizes the function of adjusting the angle of the suction nozzle through the adjustment mechanism, avoiding excessive local pressure of the chip caused by excessive suction nozzle angle Damage, not only that, but also through the control mechanism to control the suction force of the suction nozzle to absorb the chip, so as to avoid the damage of the chip caused by the suction force of the suction nozzle.

Description

technical field [0001] The invention relates to the field of chip processing equipment, in particular to a pick-up device with an angle adjustment function for chip processing. Background technique [0002] The semiconductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , although the holding tape glued on the back is cut into a little, it is not cut, and becomes the state of holding each semiconductor chip. Then, each cut semiconductor chip is picked up from the holding tape by a chip picker. During the picking process, the chip is first removed from the The wafer is lifted up, and then the surface of the chip is adsorbed by the suction nozzle to realize peeling and transfer. [0003] During the use of the existing chip pick-up equipment, most of them ...

AI Technical Summary

Problems solved by technology

[0003] During the use of the existing chip pick-up equipment, most of them achieve the adsorption effect by extracting the air in the nozzle to form a negative pressure in the nozzle, but after long-term use, the device for extracting air will be damaged due to wear or aging Reduce the accuracy of the air pressure in the suction nozzle, and the chip is relatively fragile. When the pressure of sucking the chip is too large, the chip will be broken and the reliability will be reduced. Not only that, but in the manufacturing process of the suction nozzle, due to the error generated by the manufacturing process, the The surface of the suction nozzle to absorb the chip cannot be completely level with the surface of the chip. When the angle between the surface of the suction nozzle to absorb the chip and the surface of the chip is too large, the local pressure of the chip will be too high and the chip will be crushed.

Images