Package structure of optical sensors and package method of optical sensors

Abstract

The invention provides a package structure of optical sensors and a package method of the optical sensors. The package structure comprises a sensor module and a protective glass module; multiple optical sensors of the sensor module are embedded in a first molding layer; each of the optical sensors comprises a transmitting chip and a receiving chip; light emitting surfaces of multiple transmittingchips and light-sensitive surfaces of multiple receiving chips are located in the same direction; glass units of the protective glass module penetrate through and are embedded in a second molding layer; the sensor module and the protective glass module are bonded; and the multiple glass units cover the light emitting surfaces of the multiple transmitting chips and the light-sensitive surfaces of the multiple receiving chips in a one-to-one correspondence relation. Since the transmitting chips and the receiving chips are embedded in the first molding layer, and the corresponding glass units areembedded in the second molding layer, the thickness of the package structure can be reduced. The invention further provides a package method of the optical sensors.

Description

technical field [0001] The invention relates to the field of sensors, in particular to a packaging structure of an optical sensor and a packaging method of the optical sensor. Background technique [0002] An optical sensor is a semiconductor device that senses external light and converts it into an electrical signal. Packaging the optical sensor can form the packaging structure of the optical sensor, and the packaging structure of the optical sensor can be used in electronic equipment such as cameras, smart phones, digital cameras, automotive imaging systems, and toys, for example. [0003] A commonly used packaging method for optical sensors in the prior art is COB (Chip On Board, chip on board) packaging, which is to attach the optical sensor to the interconnection substrate (usually using a PCB board) with conductive or non-conductive adhesive, and then Conduct wire bonding to realize its electrical connection, and then cover a protective glass (such as infrared glass, ...

AI Technical Summary

Problems solved by technology

However, the inventors have found that figure 1 In the package structure shown, the optical sensor 10 is located between the interconnection substrate 14 and the protective glass 14, and the superposition of the three makes the thickness of the package structure (that is, the distance in the direction perpendicular to the photosensitive surface) larger; in addition, for multiple When the optical sensor 10 is packaged, it is necessary to bond a plurality of optical sensors 10 to a whole piece of protective glass 14, and then cut the protective glass 14. However, due to the low cutting precision, the size of the formed package module is relatively large.

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