Package structure of optical sensors and package method of optical sensors
An optical sensor and packaging structure technology, applied in the field of sensors, can solve the problems of low cutting precision, large thickness distance of packaging structure, large packaging module size, etc., and achieve the effects of reducing thickness, facilitating miniaturization, and avoiding signal crosstalk
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0041] The packaging structure and packaging method of the optical sensor of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. According to the following description and drawings, the advantages and features of the present invention will be clearer. However, it should be noted that the concept of the technical solution of the present invention can be implemented in many different forms and is not limited to the specific implementation set forth herein. example. In addition, the drawings are in a very simplified form and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.
[0042] The terms "first", "second" and the like in the specification and claims are used to distinguish between similar elements, and are not necessarily used to describe a specific order or time sequence. It is to be unders...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap