Grindstone

A grinding stone and grinding technology, applied in the direction of abrasives, grinding/polishing equipment, metal processing equipment, etc., can solve the problems of hindering grinding/polishing, clogging, short grinding/polishing life, etc., and achieve improved grinding performance Effect

Pending Publication Date: 2019-06-14
NANO TEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In addition, the grindstone described in Patent Document 2 solves the problem of short grinding / polishing life due to the thick abrasive grain layer, but the high-temperature grinding debris ground by the abrasive grains will fuse to the ridges of the honeycomb structure, causing clogging , so it cannot solve the problem of hindering the next grinding / polishing

Method used

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Examples

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Effect test

Embodiment

[0099] use Figure 1-6 The flat grindstone of the present invention shown in and Picture 9 The thickness of the linear grindstone or the cup-shaped grindstone corresponding to the diameter D of the grindstone column within the scope of the present invention is 1-2 mm which is 1-100 times the average particle size of the abrasive grains 5. The distance S between adjacent grindstone pillars is 10-20 mm, which is equivalent to 10-1000 times the thickness of the diameter D of the grindstone pillar. And the porosity of the grindstone column and the grindstone base 3 is 30-60%. The total ratio of the cross-sectional area of ​​the grindstone column to the area of ​​the grinding / polishing surface of the grindstone is 0.4-7.0%, which is a lower value than before. In addition, the abrasive grains used diamond with an average particle diameter of 20 μm.

[0100] The effect of the embodiment when the abrasive grain of the present invention is made of diamond and when the workpiece W is sa...

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Abstract

The purpose of the invention is to provide a grindstone such that grinding, polishing, and super-fine polishing can be achieved using the same grindstone and without causing clogging when used continuously. The invention provides a grindstone having a grinding/polishing part which is for working a workpiece and which has a honeycomb structure comprising polygonal columns arranged without any gap therebetween, wherein the grindstone is provided with grinding columns, each comprising abrasive grains (5) and a binding material (6), having an axis L in the depth direction of a surface to be ground/polished, and disposed at an intersection or on a wall part of the honeycomb structure. A porous elastomer disposed inside the honeycomb, thereby enabling super-fine polishing.

Description

Technical field [0001] The invention relates to a grinding stone for grinding and polishing a workpiece. More specifically, the present invention relates to a grinding stone for grinding and polishing workpieces such as ceramics, silicon wafers, semiconductor substrates, LED substrates, heat dissipation substrates, SiC, alumina, sapphire, metals and alloys. Background technique [0002] Grindstone is an abrasive tool formed by hard particles, namely abrasive grains, through hardening treatment through a binder. Grinding and polishing can be used for processing using grinding stones. Traditionally, rough machining refers to grinding, and fine machining refers to polishing. In these processes, by pressing the grindstone on the workpiece to move the grindstone and the workpiece relative to each other, the surface of the workpiece, that is, the machined surface, is ground with the aid of abrasive grains, thereby removing a large amount of grinding debris. In this specification, gr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/00B24D3/10B24D3/18B24D3/26B24D3/32
CPCB24D7/10B24D7/18B24D2203/00B24D3/00B24D3/10B24D3/18B24D3/26B24D3/32
Inventor 高田笃高津雅一大桥恭介石崎幸三小野寺德朗
Owner NANO TEM
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