A pressure relief joint and a liquid cooling assembly using the pressure relief joint
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
- Publication Date
- 2021-03-23
Smart Images

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Abstract
Description
technical field
[0001] The invention relates to a pressure relief joint and a liquid cooling assembly using the pressure relief joint. Background technique
[0002] For electronic equipment using liquid cooling, when it is necessary to debug or transport the liquid cooling components, the liquid cooling components are usually disassembled from the equipment. After disassembly, the inside of the liquid cooling components is a closed space filled with liquid . When the temperature of the external environment rises, the liquid pressure inside the liquid-cooled component will increase sharply. In extreme cases, the flow channel in the liquid-cooled cold plate will bulge, the seal will fail, and leakage will occur. In order to prevent this problem from happening, the operator needs to drain the disassembled liquid cooling components one by one, so as to avoid the pressure increase of the liquid inside the liquid cooling component as the temperature increases, but this operation ...