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Packaging adhesive and packaging structure

A packaging glue and adhesive technology, which is applied in nanotechnology, electrical components, nanotechnology, etc. for materials and surface science, can solve the problem of unsatisfactory thermal conductivity and heat dissipation performance, unsatisfactory thermal conductivity and heat dissipation performance of packaging glue, and electronic components. Problems such as performance stability and unsatisfactory life, to achieve the effect of improving continuous heat dissipation, ensuring stability, and prolonging service life

Active Publication Date: 2019-06-25
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a packaging glue to solve the technical problems of unsatisfactory thermal conductivity and heat dissipation performance of the existing packaging glue
[0006] Another object of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a packaging structure to solve the technical problems of unsatisfactory performance stability and service life of electronic components due to unsatisfactory heat conduction and heat dissipation performance of the existing packaging structure

Method used

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  • Packaging adhesive and packaging structure
  • Packaging adhesive and packaging structure
  • Packaging adhesive and packaging structure

Examples

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preparation example Construction

[0030] Based on the modified hollow microspheres described in the invention examples above, the present invention also provides a method for preparing the modified hollow microspheres. The method for preparing the modified hollow microspheres includes the following steps:

[0031] Carry out surface grafting treatment on the hollow microsphere matrix to graft organic compounds onto the surface of the hollow microspheres to form hollow microspheres with organic compounds bound to the surface. The general structural formula of the organic compounds is A1-D-A2. A1 and A2 are respectively electron withdrawing groups, and the D is an organic group with a symmetric molecular structure.

[0032] In one embodiment, the step of performing surface grafting treatment on the hollow microsphere matrix to graft the organic compound to the surface of the hollow microsphere includes:

[0033] Preparation of organic solution containing isocyanate groups;

[0034] Adding hollow microspheres and a catal...

Embodiment 11

[0061] This embodiment provides a modified hollow microsphere and a preparation method thereof. The modified hollow microspheres include a polyurethane hollow microsphere matrix and the above-mentioned L1 compound bonded to the polyurethane hollow microsphere matrix.

[0062] The modified hollow microspheres described in Example 11 were prepared according to the following method:

[0063] (1) Preparation of polyurethane hollow microsphere matrix: adopt Pickering suspension polymerization method to prepare thermal hollow microspheres, and weigh 0.5g nanometer Mg(OH) 2 , 0.25g NaCl, 0.01g NaNO 2 Dissolve in 50mL deionized water, stir for 15 minutes and mix well as the aqueous phase of suspension polymerization; weigh 14g acrylonitrile, 4g methyl methacrylate, 2g butyl acrylate, 0.08g trimethylolpropane trimethacrylate, 0.4g azobisisobutyronitrile and 7g isooctane were stirred at room temperature for 30 minutes and mixed uniformly as the oil phase; after mixing the water phase and the...

Embodiment 12

[0066] This embodiment provides a modified hollow microsphere and a preparation method thereof. The modified hollow microspheres include a polyurethane hollow microsphere matrix and the aforementioned L3 compound bonded to the polyurethane hollow microsphere matrix.

[0067] The modified hollow microspheres described in Example 12 were prepared according to the following method:

[0068] (1) Preparation of polyurethane hollow microsphere matrix: refer to step (1) preparation in Example 11;

[0069] (2) Modification of the polyurethane hollow microsphere matrix: refer to the preparation in step (2) of Example 11, except that L3 is used to modify the polyurethane hollow microsphere matrix.

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Abstract

The invention discloses a packaging adhesive and a packaging structure. The packaging adhesive comprises an adhesive component, and further comprises heat dissipation nanoparticles and hollow microspheres which are dispersed in the adhesive component. The packaging structure comprises an electronic element and a packaging layer for packaging the electronic element, and the packaging layer comprises the cured packaging adhesive. The packaging adhesive of the invention has strong continuous heat dissipation ability, so that the working temperature stability of the packaged electronic element canbe guaranteed. Meanwhile, because the hollow microspheres have strong water molecule absorption ability and can absorb the water molecules generated in the working process of the packaged electronicelement, the working stability of the electronic element is ensured, and the service life of the packaged electronic element is prolonged.

Description

Technical field [0001] The invention belongs to the technical field of electronic packaging, and specifically relates to a packaging glue and a packaging structure. Background technique [0002] The life of electronic components is a very important parameter. To improve the life of electronic components and make them reach the commercial level, packaging is a crucial link. For electronic components, packaging is not only to prevent physical protection such as scratches, but also to prevent the penetration of water vapor and oxygen in the external environment. The water vapor in these environments penetrates into the inside of the device and accelerates the aging of the device. Therefore, the packaging structure of electronic components must have a good penetration barrier function. [0003] Currently, in the packaging process of commercial electronic components, packaging glue is generally used. At present, UV-curable adhesives are commonly used for packaging to insulate the de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L23/373B82Y30/00
Inventor 朱舒卷曹蔚然
Owner TCL CORPORATION
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