Supercharge Your Innovation With Domain-Expert AI Agents!

Encapsulation glue and packaging structure

An encapsulant and adhesive technology, which is applied in nanotechnology for materials and surface science, semiconductor/solid-state device components, semiconductor devices, etc. and problems such as unsatisfactory service life, unsatisfactory thermal conductivity and heat dissipation performance, etc., to achieve the effect of improving continuous heat dissipation capacity, ensuring stability and prolonging service life

Active Publication Date: 2021-06-08
TCL CORPORATION
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a packaging glue to solve the technical problems of unsatisfactory thermal conductivity and heat dissipation performance of the existing packaging glue
[0006] Another object of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a packaging structure to solve the technical problems of unsatisfactory performance stability and service life of electronic components due to unsatisfactory heat conduction and heat dissipation performance of the existing packaging structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Encapsulation glue and packaging structure
  • Encapsulation glue and packaging structure
  • Encapsulation glue and packaging structure

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] Based on the modified hollow microspheres described above in the embodiments of the invention, the present invention also provides a preparation method of the modified hollow microspheres. The preparation method of the modified hollow microspheres comprises the following steps:

[0031] Carry out surface grafting treatment to the hollow microsphere matrix, so that the organic compound is grafted onto the surface of the hollow microsphere to form a hollow microsphere with an organic compound bound to the surface. The general structural formula of the organic compound is A1-D-A2, and the A1 and A2 are electron-withdrawing groups, and D is an organic group with symmetrical molecular structure.

[0032] In one embodiment, the hollow microsphere matrix is ​​subjected to surface grafting treatment, and the step of grafting the organic compound onto the hollow microsphere surface includes:

[0033] Preparation of organic solutions containing isocyanate groups;

[0034] Add h...

Embodiment 11

[0061] This embodiment provides a modified hollow microsphere and its preparation method. The modified hollow microspheres include a polyurethane hollow microsphere matrix and the aforementioned L1 compound combined on the polyurethane hollow microsphere matrix.

[0062] The modified hollow microspheres described in Example 11 were prepared according to the following method:

[0063] (1) Preparation of polyurethane hollow microsphere matrix: Prepare hot hollow microspheres by Pickering suspension polymerization method, weigh 0.5g nanometer Mg(OH) 2 , 0.25g NaCl, 0.01g NaNO 2Dissolve in 50mL deionized water, stir for 15 minutes and mix evenly as the aqueous phase of suspension polymerization; weigh 14g acrylonitrile, 4g methyl methacrylate, 2g butyl acrylate, 0.08g trimethylolpropane trimethacrylate, 0.4g of azobisisobutyronitrile and 7g of isooctane were stirred at room temperature for 30 minutes and mixed uniformly as the oil phase; after mixing the water phase and the oil ...

Embodiment 12

[0066] This embodiment provides a modified hollow microsphere and its preparation method. The modified hollow microspheres include a polyurethane hollow microsphere matrix and the above-mentioned L3 compound combined on the polyurethane hollow microsphere matrix.

[0067] The modified hollow microspheres described in Example 12 were prepared according to the following method:

[0068] (1) Preparation of polyurethane hollow microsphere matrix: prepare with reference to the step (1) of Example 11;

[0069] (2) Modification of the polyurethane hollow microsphere matrix: preparation according to step (2) of Example 11, except that L3 is used to modify the polyurethane hollow microsphere matrix.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses an encapsulation adhesive and an encapsulation structure. The encapsulation glue includes an adhesive component, and also includes heat-dissipating nanoparticles and hollow microspheres, and the heat-dissipating nanoparticles and hollow microspheres are dispersed in the adhesive component. The packaging structure includes an electronic component and a packaging layer for packaging the electronic component. The packaging layer includes the cured packaging glue of the present invention. The encapsulation adhesive of the present invention has strong continuous heat dissipation capability, thereby effectively ensuring the stability of the working temperature of the encapsulated electronic components. At the same time, because the hollow microspheres have a strong ability to absorb water molecules, they can effectively absorb water molecules generated during the working process of the packaged electronic components, ensuring the stability of the electronic components and prolonging the service life of the packaged electronic components.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a packaging glue and a packaging structure. Background technique [0002] The lifetime of electronic components is a very important parameter. Encapsulation is a crucial link to improve the life of electronic components and make them reach commercial levels. For electronic components, encapsulation is not only physical protection to prevent scratches, but more importantly, to prevent the penetration of water vapor and oxygen in the external environment. The water vapor in these environments penetrates into the device, which will accelerate the aging of the device. Therefore, the packaging structure of electronic components must have a good permeation barrier function. [0003] Currently, encapsulation glue is generally used in the encapsulation process of commercial electronic components. At present, UV-curable glue is commonly used for packaging to i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L23/373B82Y30/00
Inventor 朱舒卷曹蔚然
Owner TCL CORPORATION
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com