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Modified hollow microsphere and its preparation method and application

A hollow and microsphere technology, which is applied in the direction of non-polymer adhesive additives, adhesive additives, polymer adhesive additives, etc., can solve the problem of unsatisfactory performance stability and life of electronic components, hollow microsphere adsorption and capture Insufficient capacity, unsatisfactory thermal conductivity and heat dissipation performance, etc., to achieve the effect of improving continuous heat dissipation capacity, increasing the degree of dipolarization and adsorption capacity, and increasing thermal conductivity

Active Publication Date: 2021-06-18
TCL CORPORATION
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the described deficiencies of the prior art, provide a modified hollow microsphere and its preparation method, to solve the technical problem of insufficient adsorption and capture capacity of the existing hollow microspheres
[0006] Another object of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a kind of encapsulant, to solve the technical problem that the existing encapsulant has unsatisfactory thermal conductivity and heat dissipation performance
[0007] Another object of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a packaging structure to solve the technical problems of unsatisfactory performance stability and service life of electronic components due to unsatisfactory heat conduction and heat dissipation performance of the existing packaging structure

Method used

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  • Modified hollow microsphere and its preparation method and application
  • Modified hollow microsphere and its preparation method and application
  • Modified hollow microsphere and its preparation method and application

Examples

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preparation example Construction

[0036] Based on the modified hollow microspheres described in the embodiments of the invention above, the present invention also provides a preparation method of the modified hollow microspheres. The preparation method of the modified hollow microspheres comprises the following steps:

[0037] Carry out surface grafting treatment to the hollow microsphere matrix, so that the organic compound is grafted onto the surface of the hollow microsphere to form a hollow microsphere with an organic compound bound to the surface. The general structural formula of the organic compound is A1-D-A2, and the A1 and A2 are electron-withdrawing groups, and D is an organic group with symmetrical molecular structure.

[0038] In one embodiment, the hollow microsphere matrix is ​​subjected to surface grafting treatment, and the step of grafting the organic compound to the surface of the hollow microsphere comprises:

[0039] Preparation of organic solutions containing isocyanate groups;

[0040]...

Embodiment 11

[0067] This embodiment provides a modified hollow microsphere and its preparation method. The modified hollow microspheres include a polyurethane hollow microsphere matrix and the above-mentioned L1 compound combined on the polyurethane hollow microsphere matrix.

[0068] The modified hollow microspheres described in Example 11 were prepared according to the following method:

[0069] (1) Preparation of polyurethane hollow microsphere matrix: adopt Pickering suspension polymerization method to prepare thermal hollow microsphere, weigh 0.5g nanometer Mg(OH) 2 , 0.25g NaCl, 0.01g NaNO 2 Dissolve in 50mL deionized water, stir for 15 minutes and mix evenly as the aqueous phase of suspension polymerization; weigh 14g acrylonitrile, 4g methyl methacrylate, 2g butyl acrylate, 0.08g trimethylolpropane trimethacrylate, 0.4g of azobisisobutyronitrile and 7g of isooctane were stirred at room temperature for 30 minutes and mixed uniformly as the oil phase; after mixing the water phase a...

Embodiment 12

[0072] This embodiment provides a modified hollow microsphere and its preparation method. The modified hollow microspheres include a polyurethane hollow microsphere matrix and the above-mentioned L3 compound combined on the polyurethane hollow microsphere matrix.

[0073] The modified hollow microspheres described in Example 12 were prepared according to the following method:

[0074] (1) Preparation of polyurethane hollow microsphere matrix: prepare with reference to the step (1) of Example 11;

[0075] (2) Modification of the polyurethane hollow microsphere matrix: Prepared with reference to step (2) of Example 11, the difference is that the polyurethane hollow microsphere matrix is ​​modified by using L3; wherein, the L3 compound is effective on the polyurethane hollow microsphere matrix The modified method is as shown in Example 11.

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Abstract

The invention discloses a modified hollow microsphere, a preparation method and application thereof. The modified hollow microspheres of the present invention include a hollow microsphere matrix and an organic compound bound on the hollow microsphere matrix, and the general molecular structure formula of the organic compound is A1-D-A2, wherein the A1 and A2 are respectively A hydrophilic group, the D is an organic group with a symmetrical molecular structure. The application of the modified hollow microsphere includes application in encapsulation glue and encapsulation structure. The modified hollow microspheres of the present invention have strong ability to absorb water molecules and the adsorption capacity of nanoparticles, and can effectively improve the thermal conductivity and the ability to capture water molecules of the encapsulation glue containing the modified hollow microspheres of the present invention, thereby significantly improving the work of the encapsulation structure. stability and longevity.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, in particular to a modified hollow microsphere and its preparation method and application. Background technique [0002] The lifetime of electronic components is a very important parameter. To improve the life of electronic components and make them reach commercial levels, packaging is a crucial link. For electronic components, encapsulation is not only physical protection to prevent scratches, but more importantly, to prevent the penetration of water vapor and oxygen in the external environment. The water vapor in these environments penetrates into the device, which will accelerate the aging of the device. Therefore, the packaging structure of electronic components must have a good permeation barrier function. [0003] Currently, encapsulation glue is generally used in the encapsulation process of commercial electronic components. At present, UV-curable glue is commonly used for...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/40C09J11/08C09J11/04C08L75/04C08L5/08
Inventor 朱舒卷曹蔚然
Owner TCL CORPORATION
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