Integrated circuit chip photoresist removing device and process

Abstract

The invention discloses an integrated circuit chip photoresist removing device and process in the field of a semiconductor integrated circuit. The device comprises a machine table. A plurality of photoresist removing groove bodies are arranged in order on the machine table, ultrasonic generators are arranged in inner groove bodies, heating devices are arranged in the inner groove bodies, wafer carriers capable of going up and down are placed in the inner groove bodies, wafer boats are placed on the wafer carriers, and the insides of outer groove bodies are connected to the bottoms of the innergroove bodies through external pipelines. The process includes a step of placing a wafer into each wafer groove of each wafer boat, a step of placing each wafer boat on a wafer carrier, a step of allowing a control rod to drive each wafer boat to go down to be submerged into a photoresist groove body, a step of allowing a circulation pump to work, at the same time, turning on the ultrasonic generators to work for N seconds, and then turning off the ultrasonic generators for N seconds, a step of repeating the above steps for M times, a step of put the wafer boats into a washing tank to wash off the photoresist on the wafers. According to the invention, the photoresist on the wafers can be removed, the photoresist is prevented from being stuck back to the wafers, and the photoresist removalefficiency is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor integrated circuits, in particular to a photoresist removal device and process for integrated circuit chips. Background technique [0002] In the prior art, in the entire manufacturing process of integrated circuit chips, the production of transparent electrodes and metal electrode patterns is often completed with photoresist, and the removal of photoresist after completing the electrodes inevitably becomes a part of the integrated circuit chip manufacturing process. an important link. [0003] In the prior art, there is a method for effectively removing photoresist, its patent application number: 201510147639.7; application date: 2015-03-31; publication number: 104882364A; publication date: 2015-09-02; the method is implemented according to the following steps : Step 1: Soak the wafer to be removed in the photoresist removal solution for 30-60 minutes; Step 2: Take out the photoresist removal soluti...

AI Technical Summary

Problems solved by technology

This method achieves the effect of thorough degumming by soaking in the photoresist solution for a sufficient time and assisting certain plasma cleaning; but its disadvantages are that the whole process takes a long time, is inefficient, and consumes a lot of degumming costs.

[0004] In the integrated circuit chip manufacturing industry, photoresist removal liquid is usually used to remove the photoresist on the surface of the wafer. This reaction uses the mechanism of "photoresist swelling + photoresist stripping + photoresist dissolution". Ultrasonic devices are added in the process to accelerate the photoresist removal reaction; but the disadvantage of this process is that because of the cavitation effect of ultrasound, a large number of jets with bubbles will be formed in the photoresist solution, and finally there will be eddy currents in the photoresist solution , Turbulent flow is generated, when the ultrasonic is normally turned on, part of the undissolved photoresist remains in the photoresist removal solution, and the photoresist cannot be removed, so it is easy for the undissolved photoresist to stick back to the chip, forming photoresist residue, Ultimately lead to loss of chip yield

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