A recovery device installed in the hole of microseismic sensor based on hot melt adhesive
A technology of microseismic sensor and hot melt adhesive, applied in the direction of seismic signal receiver, etc., can solve the problems of sensor and cable wear and damage, strict production process requirements, high cost, and solve the problems of installation and recovery, structure and production process is simple , easy to operate effect
Active Publication Date: 2021-05-18
WUHAN UNIV OF TECH
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AI Technical Summary
Problems solved by technology
[0005] (1) It is difficult to achieve good adhesion between the sensor and the hole wall;
[0006] (2) There is a risk of wear and damage of sensors and cables during the installation process of the broken rock mass drilling;
[0008] (4) The sensor installation and recovery structure is complicated, the production process is demanding and the cost is high
Method used
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Embodiment Construction
[0044] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0045] Such as Figure 1 to Figure 9 As shown, a recovery device installed in the hole of a microseismic sensor based on hot melt adhesive includes a sleeve 3, a base 6, a microseismic sensor 10, a fixed wire rope 17, a lifting wire rope 19 and a heat insulation layer 12, and the lifting wire rope 19 and the fixed wire rope 17 Connection, the fixed wire rope 17 is connected to the top of the microseismic sensor 10, the bottom of the microseismic sensor 10 and the surrounding wrap the heat insulation layer 12, the base 6 is provided with an installation groove 21 for accommodating the microseismic sensor 10, and the center of the bottom of the installation groove 21 is provided with a The positioning groove 23 of the microseismic sensor 10, the top of the mounting groove 21 is provided with a fixing ring 13 for positioning the upper p...
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The invention discloses a microseismic sensor hole installation recovery device based on hot melt adhesive, which consists of a base, hot melt adhesive, electric heating wire, heat insulation layer, microseismic sensor, sleeve and hoisting wire rope. The installation method is to connect the lifting wire rope to the top of the microseismic sensor, the heat insulation layer is wrapped around the bottom and the periphery of the microseismic sensor, the heating wire is wound on the heat insulating layer, the hot melt adhesive is evenly applied to the bottom of the base, and the microseismic sensor passes through the fixing of the base The ring is glued vertically to the bottom of the base, and then the periphery of the sensor is coupled with the base through hot melt adhesive. Melt glue is melted, and the sensor is separated from the base by lifting the wire rope. The invention solves the problem of time-consuming, laborious and high-cost installation of the existing microseismic sensor, and the device of the invention can ensure good coupling between the microseismic sensor and rock mass, and the sensor is easy to install and recover.
Description
technical field [0001] The invention relates to the technical field of geotechnical engineering microseismic monitoring, in particular to a recovery device installed in the hole of a microseismic sensor based on hot melt adhesive, which is suitable for safety monitoring of disasters such as rockbursts, roof collapses, and ground pressure shocks induced by mine excavation. Evaluation and management, open-pit slope, pillar and stope stability evaluation, short-term and long-term monitoring of rock mass stability in public safety fields such as petroleum industry, civil engineering, environmental geology, nuclear waste, waste gas storage, and strategic oil reserves. Background technique [0002] When the rock mass is excavated or disturbed by the outside world, local stress concentration will occur inside it. When the energy accumulates to a certain critical value, it will cause the generation and expansion of micro-cracks in the rock mass, and the released elastic wave or stre...
Claims
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IPC IPC(8): G01V1/20
CPCG01V1/20
Inventor 陈东方游喻豪任高峰王扶成
Owner WUHAN UNIV OF TECH