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Packaging structure, preparation method of packaging structure and organic light-emitting display

A packaging structure and organic technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of large thickness and non-compliance with requirements, and achieve the effect of simplifying the process, avoiding the intrusion of water and oxygen, and improving the impact resistance.

Pending Publication Date: 2019-07-09
SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention lies in the problem that the thickness of the organic electroluminescent device in the prior art is relatively large, which does not meet the current market demand for light-weight and flexible light-emitting devices

Method used

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  • Packaging structure, preparation method of packaging structure and organic light-emitting display
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  • Packaging structure, preparation method of packaging structure and organic light-emitting display

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Embodiment 1

[0040] An embodiment of the present invention provides a packaging structure, such as figure 2 As shown, it includes a first substrate 10 and a second substrate 20 arranged oppositely; a body to be packaged 30 arranged between the first substrate 10 and the second substrate 20; The encapsulation layer 60 covering the exposed surface of the to-be-packaged body 30; wherein the to-be-packaged body 30 is formed on the first substrate 10, and the outer side of the to-be-packaged body 30 relative to the first substrate 10 forms the In addition, on the first substrate 10 or the encapsulation layer 60, an encapsulation ring 40 is also arranged around the outer peripheral edge of the object to be encapsulated 30, and the encapsulation ring 40 is arranged on the first substrate 10 (or the encapsulation layer 60) A closed cavity is enclosed between the second substrate 20 and the second substrate 20 . Wherein, a desiccant layer 50 is interposed between the encapsulation layer 60 and th...

Embodiment 2

[0053] The embodiment of the present invention provides an organic electroluminescent device, which is different from the embodiment 1 in that the package body 30 is an organic light emitting array layer.

[0054] Such as image 3 As shown, the organic light-emitting array layer includes: a first electrode layer and spacer columns 72, and the first electrode layer includes a plurality of first electrode strips arranged parallel to each other (the first electrode layer is an anode layer in the figure, for example ITO layer), the extension direction of the isolation column 72 is perpendicular to the extension direction of the first display electrode; wherein the isolation column 72 has an inverted trapezoidal cross-section along the extension direction of the first electrode strip, The acute angle between each side in the cross section and the first electrode layer is 45°-70°. In the present invention, setting the spacer column 72 in such a structure is conducive to a good sepa...

Embodiment 3

[0066] An embodiment of the present invention provides a method for preparing an organic electroluminescent device, comprising the following steps:

[0067] Step S11, preparing an organic light-emitting array layer on the first substrate. For the structure of the organic light-emitting array layer, refer to the previous description;

[0068] Step S12 , forming a continuous encapsulation layer covering the exposed surface of the organic light emitting array layer (the surface away from the first substrate) on the first substrate.

[0069] Form an encapsulation layer 60 that continuously covers the organic light-emitting array layer and is away from the surface of the first substrate. The encapsulation layer 60 extends to the surface of the first substrate 10 to form a closed cavity with the first substrate 10. The organic light-emitting array layer is encapsulated in the inside a closed cavity.

[0070] Step S13 , disposing an encapsulation ring on the encapsulation layer arou...

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Abstract

The invention relates to the technical field of display, and discloses a packaging structure, a preparation method of the packaging structure and an organic light-emitting display. The packaging structure comprises a first substrate and a second substrate which are oppositely arranged, a to-be-packaged body formed between the first substrate and the second substrate, a packaging layer which is formed on the first substrate and continuously covers the exposed surface of the to-be-packaged body, and a drying agent layer which is clamped between the packaging layer and the second substrate, wherein the drying agent layer is a gel-state drying agent layer. According to the packaging structure, the gel-state drying agent layer is formed between the packaging layer and the second substrate by curing a liquid drying agent, and the thickness of the drying agent layer is not required, so that the water oxygen barrier capability of the packaging structure can be improved on the basis that the thickness of the packaging structure is not increased.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging structure, a preparation method thereof, and an organic electroluminescent device. Background technique [0002] Compared with liquid crystal display devices, Organic Light-Emitting Display (OLED) has the advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright colors, light and thin, etc., and is considered to be the next generation display technology. [0003] The organic material of the organic electroluminescence device is very sensitive to water and oxygen, and a small amount of water and oxygen will cause oxidation and crystallization of the organic material in the display screen or deterioration of electrodes, affecting the life of the display screen or directly causing damage to the display screen. [0004] In the prior art, a solid desiccant sheet is generally attached to the packaging sheet to achieve the purpose of absorb...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K59/8722H10K59/873H10K59/874
Inventor 穆欣炬刘宏俊史凯兴
Owner SUZHOU QUINGYUE OPTOELECTRONICS TECH CO LTD
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