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A system-in-package process for side-radiated radio frequency chips

A technology of system-level packaging and radio frequency chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of wasting substrate or PCB board area, and achieve the effect of increasing heat dissipation

Active Publication Date: 2021-04-06
浙江集迈科微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for larger-sized radio frequency chips, the embedding process of the silicon interposer board requires a more stringent heat dissipation structure. Generally, a copper block is placed under the silicon interposer module, and the copper block is connected to the substrate or PCB board. Inlaid copper structure, wasting the area on the substrate or PCB board

Method used

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  • A system-in-package process for side-radiated radio frequency chips
  • A system-in-package process for side-radiated radio frequency chips
  • A system-in-package process for side-radiated radio frequency chips

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Embodiment Construction

[0035] Embodiments of the present invention are described in detail below, wherein the same or similar reference numerals represent the same or similar elements or elements with similar functions. The embodiments described below by referring to the figures are exemplary, and are only used to explain the present invention and not to limit the present invention.

[0036] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this invention belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with the meaning in the context of the prior art, and unless defined as herein, will not be used in an idealized or overly formal meaning to explain.

[0037] The reference numerals related to the steps mentioned in ...

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Abstract

The invention discloses a system-level packaging process of a side heat dissipation type radio frequency chip, comprising the following steps: 101) base processing step, 102) cover plate processing step, 103) intermediate layer processing step, 104) packaging step; the invention provides neither It occupies the area of ​​the substrate or PCB board and can increase the heat dissipation capacity of the system. It is a side heat dissipation type RF chip system-in-package process.

Description

technical field [0001] The invention relates to the technical field of semiconductors, more specifically, it relates to a system-in-package technology of a side-radiating radio frequency chip. Background technique [0002] The rapid development of electronic products is the main driving force for the evolution of packaging technology today. Miniaturization, high density, high frequency and high speed, high performance, high reliability and low cost are the mainstream development directions of advanced packaging, among which system-in-package is the most important and One of the technologies with the greatest potential to meet such high-density system integration. [0003] Among various system-in-packages, the use of silicon interposers as the substrate technology of system-in-packages provides the shortest connection distance for chip-to-chip and chip-to-PCB boards, the smallest pad size and center-to-center spacing. Advantages of silicon interposer technology compared to o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/52H01L21/56H01L21/60
CPCH01L21/50H01L21/52H01L21/56H01L24/03
Inventor 冯光建郑赞赞陈雪平刘长春丁祥祥王永河马飞郁发新
Owner 浙江集迈科微电子有限公司