Heat dissipation component, its preparation method and electronic equipment
A technology of heat dissipation components and heat sinks, which is applied in the construction parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., and can solve the problems of reduced operating efficiency of electronic equipment, electronic equipment freezes, and hot hands when holding electronic equipment. , to achieve the effect of heat dissipation, thinning and thickness reduction
Active Publication Date: 2021-03-02
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0016] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0017] With the rapid development of electronic devices (such as mobile terminals), the power consumption of the electronic devices is gradually increasing, and accordingly, the heat generated by the electronic devices during work is also relatively large. Taking the power supply as an example, the existing heat dissipation components are fixed on the middle frame of the power supply by glue. During the heat dissipation process, the heat generated by the power supply is transferred to the he...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The embodiment of the invention provides a heat dissipation component and a preparation method thereof, and an electrode device. The heat dissipation component comprises a heat conduction substrate, ametal substrate layer, cooling fins and a heat conduction medium located between the cooling fins and the metal substrate layer. The heat conduction substrate comprises a first surface and a second surface opposite to the first surface. The metal substrate layer is formed on the first surface. The cooling fins and the metal substrate layer are arranged at intervals, and the cooling fins and the metal substrate layer are located at the same side of the heat conduction substrate. The metal substrate layer is formed at the first surface of the heat conduction substrate when preparation is performed; the cooling fins are welded at the metal substrate layer and then the heat conduction medium is arranged between the cooling fins and the metal substrate layer. According to the heat dissipationcomponent and the preparation method thereof and the electronic device, heat can be conducted by directly attaching to the heat dissipation device and then is directly transmitted to the cooling finsfor external dissipation through the heat conduction medium, so that the heat transfer efficiency is higher to more facilitate heat dissipation. The thickness of the heat dissipation component can bereduced to facilitate thinning of the electronic device.
Description
technical field [0001] The present application relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation component, its preparation method and electronic equipment. Background technique [0002] The power supply of electronic equipment or other electronic devices will generate a lot of heat during operation, which will increase the overall temperature of the electronic equipment. When the temperature rises sharply, there is a risk of spontaneous combustion. Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device. Contents of the invention [0003] The purpose of the present application is to provide a heat dissipation component, its preparation method...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20436
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD