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Mask plate, evaporation plating device and method, and design method of evaporation plating opening of mask plate

A design method and mask technology, applied in the design of evaporation openings, evaporation devices, and mask fields, can solve the problem of single alignment structure, inability to guarantee the evaporation position of the film layer, and the inability to effectively ensure the alignment between the evaporation opening and the mask plate. The accuracy of the evaporation area and other issues

Active Publication Date: 2019-07-30
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, the alignment between the mask plate 1 and the substrate to be evaporated 3 is mainly determined by the alignment holes provided on the mask plate 1 and the alignment mark on the substrate to be evaporated 3, and the alignment structure is single
Therefore, the accuracy of the alignment between the evaporation opening and the evaporation area cannot be effectively guaranteed, and the evaporation position of the film layer cannot be guaranteed if the alignment is not accurate.

Method used

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  • Mask plate, evaporation plating device and method, and design method of evaporation plating opening of mask plate
  • Mask plate, evaporation plating device and method, and design method of evaporation plating opening of mask plate
  • Mask plate, evaporation plating device and method, and design method of evaporation plating opening of mask plate

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Embodiment Construction

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0048] The embodiment of the present invention is described by taking the application of the mask plate in the manufacturing process of the display panel of the electroluminescence display device or the photoluminescence display device as an example. Wherein, the display panel in the electroluminescent display device may be an OLED display panel or a quantum dot electroluminescent diode (Quantum Dot Light Emitting Diodes, QLED for short) display p...

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Abstract

The invention provides a mask plate, an evaporation plating device and method, and a design method of an evaporation plating opening of the mask plate and relates to the technical field of display. The alignment accuracy between a substrate to be subjected to evaporation plating and the mask plate can be improved in the evaporation plating process. The mask plate is provided with a plurality of evaporation plating openings and at least one first detection opening. The size of the first detection opening is less than that of each evaporation plating opening. The first detection opening is arranged close to the at least one evaporation plating opening.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a mask, an evaporation device, an evaporation method, and a method for designing an evaporation opening in the mask. Background technique [0002] During the manufacturing process of the display panel, it is sometimes necessary to use an open mask to form certain film layers. Taking the display panel as an example of an Organic Light Emitting Diode (OLED) display panel, a mask plate can be used to vapor-deposit other functional film layers in the light-emitting functional layer except the light-emitting layer. Of course, for some types of OLED display panels, the light emitting layer can also be formed through a mask. [0003] Such as figure 1 As shown, the substrate to be evaporated 3 is located on the upper side of the mask 1 , and the evaporation source 4 is located on the lower side of the mask 1 . Since in the evaporation process, the evaporation opening on the mask plat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/24C23C14/54
CPCC23C14/042C23C14/24C23C14/54
Inventor 杨晓宇罗昶段芳芳嵇凤丽
Owner BOE TECH GRP CO LTD
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