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LTCC microwave device modeling analysis method

A technology of microwave devices and analysis methods, applied in the fields of instruments, special data processing applications, electrical digital data processing, etc., can solve the problems of inaccurate modeling and analysis, optimize the analysis process, overcome numerical errors, high efficiency and accuracy Effect

Inactive Publication Date: 2019-07-30
UNIV OF ELECTRONIC SCI & TECH OF CHINA +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is the inaccurate technical problem of modeling analysis existing in the prior art

Method used

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  • LTCC microwave device modeling analysis method
  • LTCC microwave device modeling analysis method
  • LTCC microwave device modeling analysis method

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Embodiment 1

[0040] This embodiment provides a method for modeling and analyzing LTCC microwave devices, such asfigure 1 , the LTCC microwave device modeling analysis method includes

[0041] Step 1, using Richards transformation and Kuroda rule to transform the lumped parameter elements of LTCC microwave devices into distributed parameter elements, obtain the microstrip line parameters, complete the equivalent circuit analysis, and solve the converted device circuit parameters;

[0042] Step 2, using numerical algorithm to analyze and determine the model parameters, establish the Cauchy difference function formula, and proceed based on the interpolation method of the Cauchy function, and obtain the output optimization parameters of the Cauchy interpolation function;

[0043] Step 3: Combining the device circuit parameters converted in step 1 and the output optimization parameters of the Cauchy interpolation function output in step 3 for comparative analysis, establishing the LTCC microwave...

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Abstract

The invention relates to an LTCC (Low Temperature Co-Fired Ceramic) microwave device modeling analysis method, which solves the technical problem of low accuracy, and comprises the following steps: step 1, converting lumped parameter elements of an LTCC microwave device into distributed parameter elements by using Richards conversion and Kuroda rules to complete equivalent circuit analysis; step 2, analyzing and determining model parameters by adopting a numerical algorithm, establishing a Cauchy difference function expression, performing an interpolation method based on a Cauchy function, andsolving to obtain a Cauchy interpolation function output optimization parameter; and step 3, comparing and analyzing the device circuit parameters converted in the step 1 and the Cauchy interpolationfunction output optimization parameter drawing output in the step 3. According to the technical scheme, a simulation model of the LTCC microwave device is established, simulation analysis is conducted on the simulation model of the LTCC microwave device, and modeling analysis on the LTCC microwave device is completed, so that the problem is well solved, and the method can be used for the LTCC microwave device.

Description

technical field [0001] The invention relates to the field of microwave device analysis, in particular to an LTCC microwave device modeling analysis method. Background technique [0002] Low temperature co-fired ceramic (Low Temperature Co-fired Ceramic, LTCC) technology, first of all, the prepared ceramic powder is made into a certain thickness of ceramic raw tape by casting, and then cut into a certain size and then used laser or mechanical perforation in the predetermined The position is punched, and then the designed electronic circuit pattern is printed on the multi-layer ceramic green tape with metal paste, and then these green tapes containing through holes are stacked together, and after forming, one-time sintering at a low temperature of 800-900 ° C is carried out. Finally, the terminal electrode is nickel-plated. High-end products such as multi-chip sets (MCM, Multi-Chip Module) can even package multiple large-scale integrated circuit bare chips in a module through...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/367G06F30/398
Inventor 蒋迪陈健冉普航
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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