Resin matrix with strong microwave absorbability and preparation method thereof

A technology of microwave absorption and resin matrix, applied in the field of composite materials, can solve the problems of poor microwave absorption capacity of resin matrix, large temperature fluctuation of resin system, poor compatibility of resin matrix, etc., and achieves good microwave absorption performance, optimized curing temperature and Curing, curing uniform effect

Inactive Publication Date: 2019-08-02
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, there are technical deficiencies in the microwave-curable resin matrix reported in the literature: one is that the resin matrix has a single component, the polarity of the resin matrix is ​​low, the microwave absorption capacity of the entire resin matrix is ​​poor and the final curing degree is not high; the other is to improve Resin polarity introduces nano-components, but the compatibility of nano-components with the resin matrix is ​​ofte

Method used

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  • Resin matrix with strong microwave absorbability and preparation method thereof
  • Resin matrix with strong microwave absorbability and preparation method thereof
  • Resin matrix with strong microwave absorbability and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0022] The main resin is 1,4-bis(hydroxyhexafluoroisopropyl)benzene diglycidyl ether, the microwave absorption component is ethylene glycol diglycidyl ether modified imidazole ionic liquid, and the ionic liquid modified nanometer component is microwave absorption Component Modified SiO 2 Microspheres, the curing agent uses 1,3-bis-(γ-aminopropyl)-5,5-dimethylhydantoin and bis(3-aminophenyl)methylphosphine oxide (BAMPO) according to the mass fraction of 10 :10 compound, the carbon fiber is T700 from Toray Corporation of Japan. The mass ratio of the main resin, the microwave absorbing component, the curing agent and the ionic liquid modified nano component is 100:4:20:0.1. The preparation process is as follows: 1-butyl-3 methylimidazolium tetrafluoroborate and ethylene glycol diglycidyl ether are mixed according to the ratio of parts by mass of 100:70. The mixing conditions are nitrogen atmosphere, oil bath temperature 45°C, The stirring speed is 800 rpm, and the time is 10 mi...

Embodiment 2

[0027] The main resin adopts dibromopentaerythiol diglycidyl ether, the microwave absorbing component adopts 1,2-propanediol diglycidyl ether modified imidazole ionic liquid, and the ionic liquid modified nanometer component adopts microwave absorbing component to modify carbon nanometer tube, the curing agent is 1,3-bis-(γ-aminopropyl)-5,5-dimethylhydantoin and 4-(4-hydroxyphenyl)-2,3-naphthyridine-1- The ketone is a compound with a mass fraction of 20:25, and the carbon fiber is T700 from Toray Corporation of Japan. The mass ratio of the main resin, the microwave absorbing component, the curing agent and the ionic liquid modified nano component is 100:5:45:0.5. The preparation process is as follows: 1-butyl-3-methylimidazolium tetrafluoroborate and 1,2-propanediol diglycidyl ether are mixed according to the ratio of parts by mass of 100:90, the mixing conditions are nitrogen atmosphere, oil bath temperature 50 ℃, stirring speed 700 rpm, time 5min. Then react in a nitrogen ...

Embodiment 3

[0032] The main resin adopts dibromopentaerythiol diglycidyl and 2,3-bis(2,3-epoxypropylthioethylthio)propyl 2,3-epoxypropylsulfide epoxy resin according to The compound with a mass fraction of 50:50, the microwave absorbing component uses ethylene glycol diglycidyl ether and neopentyl glycol diglycidyl ether to modify the imidazole ionic liquid according to the compound with a mass fraction of 4:1, the ion The liquid modified nano-component uses microwave absorbing components to modify graphene and Fe with a mass fraction of 0.4:0.2 3 o 4 Nanoparticle mixture, 4-(4-hydroxyphenyl)-2,3-naphthyridine-1-one as curing agent, and T700 from Toray Corporation of Japan as carbon fiber. The mass ratio of the main resin, the microwave absorbing component, the curing agent and the ionic liquid modified nano component is 100:5:30:0.6. The preparation process is as follows: mix 1-butyl-3 methylimidazolium tetrafluoroborate, ethylene glycol diglycidyl ether and neopentyl glycol diglycidyl...

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Abstract

Aresin matrix with strong microwave absorbability and a preparation method thereof belong to the field of composite materials. In the invention, high-performance epoxy resin with strong polarity is selected as matrix resin, a microwave absorptioncomponent is added for adjusting microwaveresponsiveness and viscosity of a resin system to adapt to liquid molding by winding and the like, a curing agent is selected for adjusting themicrowaveresponse activity of the resin system, and the mechanical property, the heat resistance and thedimensional stability of the resin matrix are achieved; on the basis, an ionic liquid modified nanometer component is adopted for further enhancing the microwaveresponsiveness of the resin matrix. By adjusting the component structure and thematch ratio of the matrix resin, the microwave absorption component, the curing agent,theionic liquid modified nanometer componentand the like, a microwave curing resin system with good microwave absorbability, good dispersity of the nanometer component, proper viscosity, uniform curing, excellent comprehensive mechanical property, good heat resistance and high dimensional stability is developed. The resin matrix has great guiding significance for preparation of fiber composite materials and can be widely applied to the fields of aerospace and the like.

Description

technical field [0001] The invention belongs to the field of composite materials, and mainly relates to a resin matrix with strong microwave absorption and a preparation method thereof. Background technique [0002] Thermosetting resin-based composites have been widely used in advanced technologies due to their excellent physical and chemical properties, such as high tensile and compressive strength, good dielectric properties, thermal stability, and corrosion resistance. Specifically, the curing of thermosetting resins such as epoxy resins has become increasingly important, first from their use as matrix materials for aerospace and marine structural composite components, and more recently as adhesives and adhesives for the microelectronics and electronics industries. Package encapsulants. In traditional thermal curing, energy is transferred to the material through heat convection, conduction, and radiation on the mold surface, resulting in long curing time, high energy los...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K13/06C08K9/04C08K7/18C08K7/06C08K3/04C08K3/22C08G59/50
CPCC08G59/504C08G59/5073C08K3/041C08K3/22C08K7/06C08K7/18C08K9/04C08K2003/2275C08K2201/011C08L63/00C08L2201/08C08L2205/025C08L2205/03C08K13/06C08K3/042
Inventor 贾晓龙刘欣罗锦涛还献华杨小平
Owner BEIJING UNIV OF CHEM TECH
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