Electric connection structure and manufacturing method thereof, and TFT array substrate and manufacturing method thereof
A technology of an electrical connection structure and a manufacturing method, which is applied to circuits, electrical components, electrical solid devices, etc., can solve the problems affecting the stability of the TFT array substrate and the uneven surface of the insulating cover layer.
Inactive Publication Date: 2019-08-02
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
However, exposing the insulating covering layer tends to make the surface of the insulating covering layer uneven, which affects the stability of the TFT array substrate.
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[0016] In the formation process of the array substrate in the liquid crystal display, an insulating covering layer, such as a passivation layer, is often formed on the electrical connection structure on the array substrate, and then the insulating covering layer is exposed to open the insulating covering layer. hole or bleach the insulating cover. However, exposing the insulating covering layer in the prior art tends to make the surface of the insulating covering layer uneven. The inventors of the present invention have found that the reason for the unevenness of the insulating covering layer is that the electrical connection structure formed by the metal layer will reflect the exposed light to the insulating covering layer when the insulating covering layer is exposed. layer, causing the insulating covering layer to be subjected to secondary exposure, thereby making the surface of the region where the insulating covering layer is facing the metal layer uneven.
[0017] There...
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Abstract
The invention relates to an electric connection structure manufacturing method. The method comprises steps that a substrate is provided, a matching layer is formed on the substrate, and the matching layer is a laminate layer in which niobium oxide films and silicon oxide films are alternately arranged; connection pads and connecting lines electrically connected to each other are formed on the matching layer, and the connection pads and the connecting lines are metal layers; an insulation covering layer covering the connecting lines is formed; the insulation covering layer is exposed. The invention further provides an electric connection structure, and a TFT array substrate and a manufacturing method thereof. The electric connection structure manufacturing method is advantaged in that the matching layer is arranged on the substrate, light reflected from the metal layer to the insulation covering layer during exposure can be effectively reduced, so the insulation covering layer is not easily overexposed to obtain a flat insulation covering layer.
Description
technical field [0001] The invention relates to a manufacturing method of an electrical connection structure, a manufacturing method of a thin film transistor (TFT) array substrate, and the electrical connection structure and the TFT array substrate prepared by the method. Background technique [0002] A liquid crystal display panel usually includes a TFT array substrate, an opposite substrate, and a liquid crystal layer sandwiched between the TFT array substrate and the opposite substrate. By controlling the rotation of liquid crystal molecules in the liquid crystal layer, the amount of light passing through is controlled, and Realize screen display. Wherein, the TFT array substrate includes structures such as thin film transistors, storage capacitors, connection pads and connection lines located around the TFT array substrate. After the above structure is formed, an insulating covering layer covering the above structure is usually formed, for example, a planarization laye...
Claims
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IPC IPC(8): H01L27/12G02F1/1362G02F1/1368
CPCH01L27/1259H01L27/1248H01L27/124G02F1/136286G02F1/1368G02F1/136295H01L27/1262H01L21/76834H10K10/466
Inventor 廖金阅刘家麟戴延樘吕宏哲
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD