Continuous flatly-pressing process for preparing light wafer board from ultrathin wafers

A particleboard and shavings technology, applied in the field of wood processing, can solve the problems such as production line equipment and technical information that have not yet been provided, and achieve the effects of high appearance and price, improved raw material utilization, and reduced requirements.

Active Publication Date: 2019-08-06
INST OF WOOD INDUDTRY CHINESE ACAD OF FORESTRY +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has too strict restrictions on the shape of long flakes, especially the thickness, and from the perspective of other requirements, this invention is only a laboratory technology, and no relevant production line has been provided for the application in large-scale industrial production. Equipment and technical information

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] 1) Select poplar branches with a diameter of 8-10cm, cut them into tree segments with a length of 50-100cm, send them to the disc planer 37 / 118-30K with a belt conveyor, and slice them into lengths of 60mm and widths of 40mm. Ultra-thin large pieces with a thickness of 0.30mm are sent into the silo;

[0039] 2) The shavings are quantitatively dialed into the double-layer belt dryer through the scraper. The temperature of the first layer is 110°C, the speed of the mesh belt is 20-40mm / s, the temperature of the second layer is 80°C, and the speed of the mesh belt is 40-60mm / s. After drying, the moisture content of the shavings is 8-10%, and they are sent to the silo;

[0040] 3) Transfer the dried ultra-thin large shavings to the top of the tank-type glue mixing machine OSB200, and drop freely with the initial speed of the screw head rotation, and the spray nozzle sprays atomized PMDI glue from the middle and lower sections; After finishing the glue mixing, the amount of...

Embodiment 2

[0047] 1) Select the poplar bark with a thickness of more than 3cm, cut it into tree segments with a length of 50-100cm, send it to the disc planer 37 / 118-30K with a belt conveyor, and slice it into length 50mm, width 40mm, thickness 0.30 The ultra-thin large pieces of mm are sent to the silo;

[0048] 2) Send the shavings to the double-layer belt dryer through the conveyor belt, the temperature of the first layer is 110°C, the speed of the mesh belt is 20-40mm / s, the temperature of the second layer is 80°C, the speed of the mesh belt is 30-40mm / s, and the shavings are dried Moisture content 4-6%, sent to the silo;

[0049] 3) Transfer the dried ultra-thin large pieces of shavings to the top of the tank-type glue mixing machine OSB200, and drop freely with the initial speed of the screw head rotation. The large pieces of shavings are mixed with glue, and the amount of glue is 10%, and they are directly sent to the paving area;

[0050] 4) Prepare a large piece of particleboa...

Embodiment 3

[0054] 1) Select the poplar logs with a diameter of 10-15cm, cut them into tree segments with a length of 50-100cm, send them to a disc planer 37 / 118-30K, and cut them into ultra-high-quality wood with a length of 80mm, a width of 40mm, and a thickness of 0.40mm. Thin and large pieces are sent to the silo;

[0055] 2) The shavings are quantitatively dialed into the double-layer belt dryer through the scraper. The temperature of the first layer is 120°C, the speed of the mesh belt is 20-30mm / s, the temperature of the second layer is 80°C, and the speed of the mesh belt is 20-40mm / s. After drying, the moisture content of the shavings is 4-6%, and they are sent to the silo;

[0056] 3) Transfer the dried ultra-thin large pieces of shavings to the top of the tank-type glue mixer OSB200, and drop freely with the initial speed of the screw head rotation, and spray the atomized modified urea-formaldehyde glue solution from the middle and lower sections through the glue mixing nozzle ...

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PUM

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Abstract

The invention provides a continuous flatly-pressing process for preparing a light wafer board from ultrathin wafers. The process comprises the following steps: 1) slicing wet wood raw materials into the ultrathin wafers; 2) carrying out mesh-belt low-temperature drying on the ultrathin wafers to reach a proper moisture content; 3) gluing the dried ultrathin wafers in a manner of flexible spray gluing and through a tank-type gluing machine; 4) uniformly laying the glued ultrathin wafers by virtue of a plurality of groups of multi-shape laying heads to obtain a board blank; and 5) carrying out hot-pressing shaping on the board blank in a manner of continuous hot-pressing. The process has the following characteristics: the ultrathin wafers are prepared by virtue of middle- and low-grade raw materials, the shape integrity of the wafers is kept through the methods of flexible drying and gluing, then the structure uniformity of the board blank is ensured by virtue of the layered laying of the plurality of laying heads, and continuous production line preparation for the high-performance and low-density wafer board is realized. The preparation process is high in production efficiency; andthe prepared wafer board product is low in density, high in performance, and high in market competitiveness.

Description

technical field [0001] The invention belongs to the field of wood processing and relates to a light-weight wood-based panel manufacturing technology, in particular to a continuous flat pressing process for preparing lightweight particleboard from ultra-thin large shavings. Background technique [0002] In recent years, the custom home furnishing industry has developed rapidly, and a large number of particleboards have been used in custom furniture. Lightweight is an urgent demand for wood-based materials such as particleboard in the custom home furnishing industry. At present, the density of particleboard products at home and abroad is basically 0.62-0.72g / cm 3 Between, if the particleboard density is reduced to 0.50-0.55g / cm 3 At the same time, compared with the existing particleboard, it can save at least 19% of wood materials, which also means the same amount of wood resources, and the industrial value-added is more than 15%. At the same time, it can also reduce the cost...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27L11/02B27N3/02B27N3/10B27N3/18
CPCB27L11/02B27N3/02B27N3/10B27N3/18
Inventor 郭文静高黎罗书品王正黄岭张玉春
Owner INST OF WOOD INDUDTRY CHINESE ACAD OF FORESTRY
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