Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A decap box

A box and chemical technology, applied in the direction of instruments, measuring devices, electronic circuit testing, etc., can solve the problems of inflexible use, high cost, and no guarantee for the safety of operators, and achieve the effect of convenient use and high safety

Active Publication Date: 2021-01-08
纳瑞科技(北京)有限公司
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of chemical corrosion and unsealing of the existing ic chip, acid overflows when the chip is unpacked, the safety of the operator is not guaranteed, the chemical corrosion temperature is not well controlled, and the problem of neutralizing the exhaust gas is not solved
The existing chip unsealing machine is expensive and requires a special opening mold, which is inflexible to use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A decap box
  • A decap box
  • A decap box

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be embodied in other different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing this embodiment is to make the disclosure of the present invention more comprehensive and thorough. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0040] Such as figure 1 and Figure 5, a DECAP box, comprising a box body, the box is pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a DECAP box comprising a box body. A chemical storage position and a heating device are arranged in the box body. A first through hole and a second through hole are formed at positions, being close to the chemical storage position and the heating device, of the side wall of the box body; and a first sliding door and a second blocking door that can be pushed and pulled movably are arranged at the outer side of the first through hole and the second through hole respectively. When the first sliding door is closed, the first through hole is blocked completely by the first sliding door; and when the second sliding door is closed, the second through hole is blocked completely by the second sliding door. Besides, a third through hole is formed in the top of the box body and is connected to a neutralization reaction container through a hose. A transparent observation window is disposed on the side wall of the box body. The DECAP box has advantages of high safety, greatconvenience in use and low cost.

Description

technical field [0001] The invention relates to the technical field of IC chip unsealing, in particular to a DECAP box. Background technique [0002] The chip unsealing machine is divided into two types: chemical etching and laser unsealing, which are used to remove the IC sealant, while keeping the function of the chip intact, in preparation for the next step of chip failure analysis. [0003] Chinese patent (CN204741006U) discloses a kind of uncapping device of the MEMS chip of wafer level package, is made up of uncapping jig, electric furnace and vacuum system, and uncapping jig is placed on electric furnace, and electric furnace is placed in vacuum chamber; It is composed of top layer, upper layer, lower layer, guide rod and traction device. The guide rod passes through the top layer and the upper layer and is fixed on the lower layer. The traction device is located between the top layer and the upper layer. The main body of the top layer is the top plate. The main body...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2898
Inventor 达晓冬
Owner 纳瑞科技(北京)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com