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Film forming method, film forming apparatus, and film-formed composite substrate

A technology of substrate and control device, which is applied in the photoengraving process of pattern surface, photosensitive materials and instruments for opto-mechanical equipment, etc., can solve the problems of consumption of ink and excessive thickness of resist film, etc.

Active Publication Date: 2022-05-10
SUMITOMO HEAVY IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the resist film in the relatively thin part has sufficient etching resistance, the resist film in the relatively thick part will become too thick
Therefore, the ink will be consumed in vain

Method used

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  • Film forming method, film forming apparatus, and film-formed composite substrate
  • Film forming method, film forming apparatus, and film-formed composite substrate
  • Film forming method, film forming apparatus, and film-formed composite substrate

Examples

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Embodiment Construction

[0035] Below, refer to Figure 1A ~ Figure 6 , the film forming apparatus and film forming method based on the examples will be described. Figure 1A It is a schematic front view of the film forming apparatus based on an Example. A table 12 is supported on the base 10 via a moving mechanism 11 . Define an xyz orthogonal coordinate system in which the x-axis and y-axis are oriented horizontally and the z-axis is oriented upward in the vertical direction. The moving mechanism 11 is controlled by the control device 50, and moves the table 12 in two directions of the x direction and the y direction. As the moving mechanism 11, for example, an XY stage including the X-direction moving mechanism 11X and the Y-direction moving mechanism 11Y can be used. The X direction moving mechanism 11X moves the Y direction moving mechanism 11Y in the x direction with respect to the base 10 , and the Y direction moving mechanism 11Y moves the table 12 in the y direction with respect to the base...

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PUM

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Abstract

The present invention provides a film forming method capable of reducing irregularities on the film surface. The frame portion is formed by applying ink along the edge of a predetermined area on the surface of the substrate where a film should be formed and curing it. Ink is applied to the inside of a predetermined area and cured to form a rough coating portion provided with gaps not coated with ink. After the frame portion and the rough coating portion are formed, the ink is applied to the gap between the rough coating portion, and the time from ink application to curing when the frame portion is formed and the time from the time when the rough coating portion is formed are elapsed. After a long time from application of the ink to curing, the ink applied in the gap is cured to form a film covering the entire predetermined region.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2018-013310 filed on January 30, 2018. The entire contents of this Japanese application are incorporated herein by reference. technical field [0002] The present invention relates to a film forming method, a film forming device and a composite substrate formed with a film. Background technique [0003] A technique for forming an etching resist film by an inkjet printing method is known (Patent Document 1 below). Compared with the method of forming a resist film by spin coating, since a photolithography step is not required, the number of steps can be reduced. [0004] Patent Document 1: Japanese Patent Laid-Open No. 2010-56266 [0005] In order for a resist film to have resistance against an etching environment, it needs to have a certain degree of thickness. When a resist film is formed by an inkjet printing method, generally unevenness reflecting the original shape of ink droplets appears ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/039G03F7/16
CPCG03F7/004G03F7/039G03F7/16H01L21/02288H01L21/02307H01L21/6715H01L21/67098
Inventor 镒广诚
Owner SUMITOMO HEAVY IND LTD