A chip pickup device with buffer and reinforcement functions

Abstract

The invention relates to a chip pickup device with buffer and reinforcement functions, which includes a vacuum pump and a suction nozzle, and also includes a buffer mechanism and a reinforcement mechanism. The buffer mechanism includes a first suction pipe, a second suction pipe, a connecting hose and at least two buffer Assemblies, the buffer assembly includes a second fixed block, a first fixed block, a connecting rod, a spring and a limit plate, the reinforcement mechanism includes a drive assembly and two fixed assemblies, and the fixed assembly includes a first transmission rod, a second Two transmission rods and support rods, the drive assembly includes a motor, a screw rod, a drive block and two bearings. In the chip pickup device with buffer and reinforcement functions, under the buffer effect of the buffer mechanism, the impact of the suction nozzle on the chip is reduced. The pressure of the chip reduces the probability of the chip being crushed and improves the practicability of the chip pick-up equipment. Through the reinforcing effect of the reinforcement mechanism on the suction nozzle, the probability of the suction nozzle detaching is reduced, and the practicability of the chip pick-up equipment is further improved. sex.

Description

technical field [0001] The invention relates to the field of chip pickup equipment, in particular to a chip pickup equipment with buffer and reinforcement functions. Background technique [0002] The semiconductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , Although the holding tape bonded to the back is cut into a little, it is not cut, and it becomes the state of holding each semiconductor chip. Next, each cut semiconductor chip is picked up from the holding tape by a chip sorter. During the picking process, the chip is first Lift up from the wafer, and then absorb the surface of the chip through the suction nozzle to achieve peeling and transfer. [0003] When the chip picking equipment of the prior art picks up the chip, the suction nozzle moves...

AI Technical Summary

Problems solved by technology

[0003] When the chip picking equipment of the prior art picks up the chip, the suction nozzle moves downward to contact the chip, and then the chip is sucked up by the suction nozzle. The pressure generated by the chip may cause the chip to be crushed, which reduces the practicability of the chip picking device. Not only that, when the operator installs the suction nozzle on the suction pipe, there is no reinforcement between the suction nozzle and the suction pipe. With the increase of time, the connection between the suction nozzle and the suction pipe becomes loose. During the high-speed movement of the suction pipe, the suction nozzle is prone to fall off under the action of inertia, which further reduces the practicability of the chip picking equipment.

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