Substrate cleaning head and substrate cleaning device

A technology for cleaning heads and substrates, applied in cleaning methods and utensils, cleaning methods using liquids, cleaning methods using gas flow, etc., can solve the problems that the drying effect is not as good as the horizontal method, and unfavorable pollutants are removed from the surface of the substrate, etc., to achieve structural Reasonable, prolonging the service life and ensuring the effect of use

Pending Publication Date: 2019-08-23
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The vertical cleaning unit can save equipment space, and the process consistency of megasonic cleaning and scrubbing is better. However, due to the influence of gravity during the drying process, the drying effect is not as good as that of the horizontal method, and the horizontal cleaning unit is not conducive to the timely removal of pollutants. Remove the substrate surface

Method used

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  • Substrate cleaning head and substrate cleaning device
  • Substrate cleaning head and substrate cleaning device
  • Substrate cleaning head and substrate cleaning device

Examples

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Embodiment Construction

[0046] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions.

[0047] The accompanying drawings in this specification are schematic diagrams, which assist in explaining the concept of the...

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PUM

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Abstract

The invention discloses a substrate cleaning head. The substrate cleaning head comprises a disc-shaped base with a certain thickness and a circular cleaning pad which is concentrically connected to the lower surface of the base, the base is provided with a plurality of fluid channels in the thickness direction, the cleaning pad is provided with a plurality of through holes, each through hole is coupled to different fluid channels, so that cleaning liquid can be sprayed to the surface of a substrate via one part of the plurality of through holes and can be sucked away through the other part ofthe through holes after being combined with pollutants, the section radius of the cleaning pad is smaller than the radius of the cross section of the base, an inclined through flushing channel is arranged on the outer peripheral side of the base, so that the flushing fluid can flow out through the upper port and the flushing channel from the upper port at the outer side of the cleaning pad so as to remove the pollutants attached to the peripheral side of the cleaning pad.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a substrate cleaning head and a substrate cleaning device. Background technique [0002] With the rapid development of the semiconductor industry, the feature size of integrated circuits tends to be miniaturized, and semiconductor chips are developing in the direction of small volume, high circuit density, fast speed, and low power consumption. Integrated circuits have now entered the submicron level of ultra-large-scale integrated circuits technical stage. With the gradual increase of the diameter of the silicon wafer, the width of the reticle in the component is gradually reduced, the number of metal layers is increased, and the flattening of the surface of the semiconductor film has an important impact on the high performance, low cost, and high yield of the device. The surface of the silicon wafer The flatness requirements will become increa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/10B08B5/04B08B13/00
CPCB08B3/022B08B3/044B08B5/043B08B13/00
Inventor 赵德文李长坤蒋阳波刘远航路新春
Owner TSINGHUA UNIV
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