Heat dissipation substrate, solid-state laser and packaging method of solid-state laser
A solid-state laser and substrate technology, applied in laser cooling devices, parts of solid-state lasers, lasers, etc., can solve problems such as poor heat dissipation, improve heat dissipation effect, solve the impact of long-term stable operation, and improve heat dissipation efficiency. Effect
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0029] see Figure 1-2 , this embodiment schematica...
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