Inkjet head and inkjet printer
An inkjet head and ink technology, applied in printing, inking devices, printed circuits, etc., can solve the problems of increasing the mounting area of the driver IC, worsening the ejection characteristics, and hindering the miniaturization of the device.
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no. 1 approach 〕
[0025] (inkjet head 3)
[0026] figure 1 is a diagram showing a schematic configuration of an electrical circuit of the inkjet head 3 of the embodiment, in which figure 1 (a) is a general example, figure 1 (b) is a modified example.
[0027] The inkjet printer 1 includes a plurality of inkjet heads 3 . In addition, the inkjet printer 1 includes an ink supply unit that supplies ink to the inkjet head 3 , a medium conveyance unit that conveys a storage medium to the inkjet head 3 , a print control unit, and the like (none of which are shown).
[0028] Each inkjet head 3 includes a plurality of actuators 7, a drive IC 8, and the like. The driver IC 8 includes a driver circuit including an output transistor 8T.
[0029] One end of the plurality of actuators (elements) 7 is connected to the individual wiring 11 , and the other end is connected to the common wiring 16 .
[0030] The individual wiring 11 is a wiring connected to each actuator 7 individually, and is connected to...
no. 2 approach 〕
[0136] (inkjet head 4)
[0137] Figure 5 is a diagram showing the inkjet head 4 of the second embodiment, in which Figure 5 (a) shows the state before joining, Figure 5 (b) shows the state after joining. For convenience of description, the flexible substrate 40 and the interposer substrate 30 are illustrated with wiring and the like passing through the substrate.
[0138] The same reference numerals and the like are attached to the same components as those of the inkjet head 3 of the first embodiment, and description thereof will be omitted.
[0139] The inkjet head 4 includes a head substrate 10 , a flexible substrate 40 , and a relay substrate 30 . Between the head substrate 10 and the relay substrate 30 , two flexible substrates 40 are arranged in parallel.
[0140] (flexible substrate 40)
[0141] The flexible substrate 40 has substantially the same structure as the flexible substrate 20 .
[0142] The flexible substrate 40L on the left does not have the common c...
no. 3 approach 〕
[0156] (inkjet head 5)
[0157] Figure 7 It is a figure which shows the inkjet head 5 of 3rd Embodiment. For convenience of description, the flexible substrate 40 and the interposer substrate 30 are illustrated with wiring and the like passing through the substrate.
[0158] The same reference numerals and the like are attached to the same components as those in the inkjet heads 3 and 4 of the first and second embodiments, and description thereof will be omitted.
[0159] The inkjet head 5 includes a head substrate 10 , a flexible substrate 40 , and a relay substrate 30 . Between the head substrate 10 and the relay substrate 30 , three flexible substrates 40L, 40C, and 40R are arranged in parallel.
[0160] (flexible substrate 40)
[0161] The flexible substrate 40L on the left does not have the common connection wiring 26R, and the flexible substrate 40R on the right does not have the common connection wiring 26L. The central flexible substrate 40C does not have the com...
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