OLED display panel and manufacturing method thereof

Abstract

The invention provides an OLED display panel and a manufacturing method thereof. The method for manufacturing an OLED display panel includes: providing a substrate, on which a through-hole area is divided; forming a hydrophilic-hydrophobic transition layer in the through-hole area, and the surface state of the hydrophilic-hydrophobic transition layer is a hydrophilic state; A plurality of OLED devices are formed on the substrate, and there are gaps between the orthographic projections of the plurality of OLED devices on the substrate and the orthographic projection of the through hole area on the substrate; on the surface of the OLED device, the surface of the hydrophilic-hydrophobic transition layer, and the exposed surface of the substrate Form an encapsulation layer on the surface; make the state of the hydrophilic-hydrophobic transition layer on the surface of the through hole area change from a hydrophilic state to a hydrophobic state; Water-hydrophobic transition layer and encapsulation layer. As a result, the hydrophilic-hydrophobic transition layer and encapsulation layer corresponding to the through-hole area can be removed easily, quickly and completely, so as to facilitate the formation of subsequent through-holes; and the process is simple, which can reduce the risk of defects in manufacturing.

Description

technical field [0001] The present invention relates to the field of display technology, in particular, to an OLED display panel and a manufacturing method thereof. Background technique [0002] Organic electroluminescent devices (OLEDs) are display lighting devices that have been gradually developed in recent years. Due to their advantages such as high response, high contrast, and flexibility, they are considered to have broad application prospects. An OLED device generally includes a substrate, a TFT structure disposed on the substrate, a self-luminous layer disposed on the TFT structure, and an encapsulation film encapsulating the self-luminous layer. refer to figure 1 As shown, when making an OLED device, it is generally necessary to open a hole in the display area 1 of the OLED device to form a round hole 2 for placing the camera, earpiece and other components, and many products used in wearables also need to dig holes. to add other objects such as figure 2 As shown...

AI Technical Summary

Problems solved by technology

When the current hole-digging method cuts the area that needs to be opened, the cut section of the self-luminous layer in the OLED device will be exposed to the external environment, and the water vapor and oxygen in the external environment will corrode and damage the self-luminous layer, resulting in OLED device damage, such as image 3 shown, where image 3 The OLED display panel in includes a substrate 10, an OLED device 20 disposed on the substrate 10, and an encapsulation layer 30 encapsulating the OLED device 20

[0003] At present, in order to solve the problem that the cut section of the self-luminous layer in the above-mentioned OLED device is exposed to the external environment, an inverted trapezoidal structure 50 can be set in the hole-digging area, and then the holes are dug by two encapsulation methods. For the structural diagram, refer to Figure 4 , the display panel includes a substrate 10, a first encapsulation layer 31, a flat layer 40, an OLED device 20, a second encapsulation layer 32, and an inverted trapezoidal structure 50, the setting of the inverted trapezoidal structure can reduce the residue of encapsulation material during cutting, and the inverted Compared with the positive trapezoidal structure, the trapezoidal structure has poorer stability and is easy to fall off during cutting. The above method can effectively cut and form through holes, but the setting of the inverted trapezoidal structure not only increases the MASK process, but also deposits other films on the inverted trapezoidal structure. The unfavorable phenomenon of film layer breakage (under out) is prone to occur in the multi-layer structure, which increases the risk of failure. In addition, the OLED device needs to be packaged twice, which increases the complexity of the process.

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