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Anti-collision device for cleaning equipment for semiconductor components

A technology for cleaning equipment and anti-collision devices, which is applied in the mechanical field and can solve problems such as damage and damage to semiconductor components.

Active Publication Date: 2021-08-27
江苏晶度半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the actual use of semiconductor element cleaning equipment, it is necessary to use a mobile device such as a cart to deliver the semiconductor element to be cleaned to the semiconductor element cleaning equipment. When the mobile device such as a cart is close to the semiconductor element cleaning equipment, it will The impact on the surface of the semiconductor element cleaning equipment will cause damage to the surface of the semiconductor element cleaning equipment and cause the semiconductor element in the mobile device to vibrate and cause damage to the semiconductor element. In view of this, we propose an anti-collision device for semiconductor element cleaning equipment

Method used

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  • Anti-collision device for cleaning equipment for semiconductor components
  • Anti-collision device for cleaning equipment for semiconductor components
  • Anti-collision device for cleaning equipment for semiconductor components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] As a first embodiment of the present invention, a semiconductor element cleaning equipment anti-collision device, such as Figure 1-4 As shown, the main body of the cleaning equipment 1 is included, and the bottom edge of the main body of the cleaning equipment 1 is abutted with a protective device 2. The protective device 2 is composed of a pair of symmetrically distributed protective mechanisms 21, and the left end of the protective mechanism 21 on the right is installed with a Several sliding rods 22 are inserted into the protection mechanism 21 on the left side and are slidably connected with the protection mechanism 21 on the left side.

[0033] In this embodiment, the protection mechanism 21 includes a front baffle 211 and a sliding sleeve rod 212 installed at the corner of the rear end of the front baffle 211. Universal wheel 213, so that protective device 2 can move conveniently by universal wheel 213, wheel brake 2131 is installed on universal wheel 213, when p...

Embodiment 2

[0037] As the second embodiment of the present invention, in order to facilitate the adjustment of the distance between the protective device 2 and the cleaning equipment main body 1 and to protect the corner of the front end of the cleaning equipment main body 1, as Figure 5 with Image 6 As shown, the corner of the rear end of the front baffle 211 is provided with a sliding square rod 2114 for installing the sliding sleeve rod 212, the sliding sleeve rod 212 is a square rod-shaped structure, and the front end of the sliding sleeve rod 212 is provided with a sliding square rod 2114 for socketing The sliding square hole 2122, the top surface of the front end of the sliding sleeve rod 212 is provided with a threaded hole communicating with the sliding square rod 2114, the second screw handle 2123 is installed in the threaded hole, and the bottom of the second screw handle 2123 is tightly welded with threads Rod, the threaded rod is threadedly connected with the threaded hole o...

Embodiment 3

[0041] As a third embodiment of the present invention, a method for using an anti-collision device for semiconductor element cleaning equipment includes the following steps:

[0042] Step 1: Put the corner guard 3 on one of the protective mechanisms 21 against the corner of the front end of the cleaning equipment main body 1, and then pull the other protective mechanism 21 outward along the direction of the slide bar 22, so that the two protective mechanisms are on the same side of the slide bar 22 gradually move away from it under the action, and stop the pulling of the protective mechanism 21 when the corner guard 3 on the structure of another protective mechanism 21 can lean against another corner of the front end of the cleaning equipment main body 1;

[0043] Step 2: After stopping the pulling of the protective mechanism 21, tighten the first screw handle 2113 on the left protective mechanism 21, so that the bottom end of the threaded rod of the first screw handle 2113 wil...

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PUM

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Abstract

The present invention relates to the field of mechanical technology, in particular to an anti-collision device for semiconductor element cleaning equipment, which includes a main body of the cleaning equipment, and a protective device is attached to the bottom edge of the main body of the cleaning equipment. The protective device is composed of a pair of symmetrically distributed protective mechanisms. The two protection mechanisms are slidably connected through a slide bar, and corner guards are installed on each protection mechanism. The semiconductor component cleaning equipment anti-collision device, through the protective device provided, the protective device can block the mobile devices such as carts driving towards the main body of the cleaning equipment, preventing the mobile devices such as carts from colliding with the main body of the cleaning equipment. The corner plate protects the corner of the front end of the main body of the cleaning device, and the distance between the front end of the protective device and the main body of the cleaning device can be adjusted by enabling the sliding sleeve rod to slide relative to the front baffle.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to an anti-collision device for semiconductor element cleaning equipment. Background technique [0002] Semiconductor component cleaning equipment is used in the cleaning process of wafer-level packaging. It can effectively remove the crystal Round surface particles, organic matter, metal ions and other sundries. In the actual use of semiconductor element cleaning equipment, it is necessary to use a mobile device such as a cart to deliver the semiconductor element to be cleaned to the semiconductor element cleaning equipment. When the mobile device such as a cart is close to the semiconductor element cleaning equipment, it will The impact on the surface of the semiconductor element cleaning equipment will cause damage to the surface of the semiconductor element cleaning equipment and cause damage to the semiconductor element after the semiconductor element in the mobile device ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67F16M3/00F16F15/02
CPCF16F15/02F16F2230/0005F16F2230/0023F16M3/00H01L21/67023
Inventor 凌永康杜良辉孙国标
Owner 江苏晶度半导体科技有限公司