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Aluminum substrate

An aluminum substrate and base layer technology, applied in circuit devices, electrical connection printed components, printed circuit components, etc., can solve the problems of parasitic capacitance affecting stable use, flexible circuit boards being susceptible to interference, etc. Conducive to heat dissipation and improve shielding effect

Active Publication Date: 2019-09-06
广德通灵电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an aluminum substrate in order to solve the problem that the existing flexible circuit board is easily disturbed during operation and the parasitic capacitance affects the stability of use.

Method used

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  • Aluminum substrate
  • Aluminum substrate
  • Aluminum substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment one, with reference to Figure 1~2 and 6-7, an aluminum substrate, including a bonding base layer 1, the upper and lower sides of the bonding base layer 1 are respectively connected with a resin film layer 2, and the resin film layer 2 is evenly provided with a shielding strip 3, and the shielding strip 3 passes through the The connection seat 8 is fixed on the resin film layer 2, and a cavity 9 is formed between adjacent shielding strips 3, and the shielding layer 4 is connected to the shielding strip 3, and the corresponding hole 9 is opened between adjacent shielding layers 4. There is an opening 5, and the top of the bonding base layer 1 is equipped with a shielding wiring 6 corresponding to the position of the shielding strip 3 on the resin film layer 2, and the first signal wiring 7 is arranged at intervals between adjacent shielding wirings 6, The through-hole 10 is evenly opened on the bonding base layer 1, and the position of the through-hole 10 is s...

Embodiment 2

[0037] Embodiment two, refer to Figure 2~3 And 6-7, an aluminum substrate, including a bonding base layer 1, the upper and lower sides of the bonding base layer 1 are respectively connected with resin film layers 2, and the resin film layer 2 is evenly provided with shielding strips 3, and the shielding strips 3 pass through The connection seat 8 is fixed on the resin film layer 2, and a cavity 9 is formed between adjacent shielding strips 3, and the shielding layer 4 is connected to the shielding strip 3, and the positions corresponding to the holes 9 are opened between adjacent shielding layers 4. There is an opening 5, and the upper and lower sides of the bonding base 1 are respectively equipped with shielding wires 6 at positions corresponding to the shielding strips 3 on the resin film layer 2, and the shielding wires 6 on the upper and lower sides are respectively staggered up and down to provide a second A signal wiring 7 and a second signal wiring 11, the bonding base...

Embodiment 3

[0040] Embodiment three, refer to figure 2 and 4 and 6-7, an aluminum substrate, including a bonding base layer 1, the upper and lower sides of the bonding base layer 1 are respectively connected with a resin film layer 2, and the resin film layer 2 is evenly provided with a shielding strip 3, and the shielding strip 3 passes through the The connection seat 8 is fixed on the resin film layer 2, and a cavity 9 is formed between adjacent shielding strips 3, and the shielding layer 4 is connected to the shielding strip 3, and the corresponding hole 9 is opened between adjacent shielding layers 4. There is an opening 5, and the upper and lower sides of the adhesive base layer 1 are respectively equipped with shielding wiring 6 at the positions corresponding to the shielding strips 3 on the resin film layer 2, and the shielding wiring 6 on the upper and lower sides are respectively staggered up and down. A signal wiring 7 and a second signal wiring 11, the bonding base layer 1 is...

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PUM

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Abstract

The invention discloses an aluminum substrate. The aluminum substrate comprises a pasting base layer, wherein resin film layers are respectively connected with positions of an upper side and a lower side of the pasting base layer, shielding strips are uniformly arranged on the resin film layers and are fixed on the resin film layers by connection seats, a hole is formed between adjacent shieldingstrips, a shielding layer is connected to the shielding strips, an opening part is formed in a position corresponding to the hole between the adjacent shielding strips, shielding lines are arranged atpositions, corresponding to shielding strips on the resin film layers, of the top of the pasting base layer, a first single line is spaced between the adjacent shielding lines, penetrating through holes are uniformly formed in the pasting base layer, and the positions of the penetrating through holes and the positions of the holes are staggered in a left-right way. In the aluminum substrate, electromagnetic shielding substances are arranged around the signal lines, the aluminum substrate has high shielding function, so that the interference-resistant capability of the signal lines is improved, mutual interference between the signal lines and the shielding lines is prevented, and meanwhile, parasitic capacitance is prevented.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, in particular to an aluminum substrate. Background technique [0002] At present, there are mainly two types of aluminum substrates. The first is the aluminum substrate using flexible materials as the substrate, and the other is the aluminum substrate using rigid materials as the substrate. Among them, the aluminum substrate using flexible materials as the substrate is generally in the form of Polyimide is used as the bottom plate, and copper foil is attached to the surface as a printed circuit conductor. It has excellent electrical characteristics. Compared with traditional PCBs, FPC has extremely high flexibility, making it naturally suitable for circuits in three-dimensional space. interconnection. Under the premise of meeting high reliability, FPC can save a lot of installation controls, make electronic equipment thinner and smaller, and at the same time have the characteristics of go...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0218H05K1/115
Inventor 吴瑜
Owner 广德通灵电子有限公司