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An aluminum substrate

A technology of aluminum substrate and base layer, applied in the direction of electrical connection of printed components, reduction of crosstalk/noise/electromagnetic interference (, printed circuit components, etc., can solve problems such as parasitic capacitance affecting stable use, flexible circuit boards are susceptible to interference, etc., Achieve the effect of improving electromagnetic shielding effect, facilitating heat dissipation and reducing stiffness

Active Publication Date: 2022-04-12
广德通灵电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an aluminum substrate in order to solve the problem that the existing flexible circuit board is easily disturbed during operation and the parasitic capacitance affects the stability of use.

Method used

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  • An aluminum substrate
  • An aluminum substrate
  • An aluminum substrate

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Experimental program
Comparison scheme
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Embodiment 1

[0034] Embodiment one, with reference to Figure 1~2 and 6-7, an aluminum substrate, including a bonding base layer 1, the upper and lower sides of the bonding base layer 1 are respectively connected with a resin film layer 2, and the resin film layer 2 is evenly provided with a shielding strip 3, and the shielding strip 3 passes through the The connection seat 8 is fixed on the resin film layer 2, and a cavity 9 is formed between adjacent shielding strips 3, and the shielding layer 4 is connected to the shielding strip 3, and the corresponding hole 9 is opened between adjacent shielding layers 4. There is an opening 5, and the top of the bonding base layer 1 is equipped with a shielding wiring 6 corresponding to the position of the shielding strip 3 on the resin film layer 2, and the first signal wiring 7 is arranged at intervals between adjacent shielding wirings 6, The through-hole 10 is evenly opened on the bonding base layer 1, and the position of the through-hole 10 is s...

Embodiment 2

[0037] Embodiment two, refer to Figure 2~3 and 6-7, an aluminum substrate, including a bonding base layer 1, the upper and lower sides of the bonding base layer 1 are respectively connected with a resin film layer 2, and the resin film layer 2 is evenly provided with a shielding strip 3, and the shielding strip 3 passes through the The connection seat 8 is fixed on the resin film layer 2, and a cavity 9 is formed between adjacent shielding strips 3, and the shielding layer 4 is connected to the shielding strip 3, and the corresponding hole 9 is opened between adjacent shielding layers 4. There is an opening 5, and the upper and lower sides of the adhesive base layer 1 are respectively equipped with shielding wiring 6 at the positions corresponding to the shielding strips 3 on the resin film layer 2, and the shielding wiring 6 on the upper and lower sides are respectively staggered up and down. A signal wiring 7 and a second signal wiring 11, the bonding base layer 1 is unifor...

Embodiment 3

[0040] Embodiment three, refer to figure 2 and 4 and 6-7, an aluminum substrate, including a bonding base layer 1, the upper and lower sides of the bonding base layer 1 are respectively connected with a resin film layer 2, and the resin film layer 2 is evenly provided with a shielding strip 3, and the shielding strip 3 passes through the The connection seat 8 is fixed on the resin film layer 2, and a cavity 9 is formed between adjacent shielding strips 3, and the shielding layer 4 is connected to the shielding strip 3, and the corresponding hole 9 is opened between adjacent shielding layers 4. There is an opening 5, and the upper and lower sides of the adhesive base layer 1 are respectively equipped with shielding wiring 6 at the positions corresponding to the shielding strips 3 on the resin film layer 2, and the shielding wiring 6 on the upper and lower sides are respectively staggered up and down. A signal wiring 7 and a second signal wiring 11, the bonding base layer 1 is...

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Abstract

The invention discloses an aluminum base plate, comprising a bonding base layer, the upper and lower sides of the bonding base layer are respectively connected with a resin film layer, the resin film layer is evenly provided with shielding strips, and the shielding strips are fixed to the resin film layer through a connecting seat On the top, holes are formed between adjacent shielding strips, shielding layers are connected to the shielding strips, openings are formed between the adjacent shielding layers corresponding to the positions of the holes, and the inner top of the bonding base layer corresponds to the resin film layer Shielded wiring is installed at the position of the shielding strip on the upper side, and a first signal wiring is arranged at intervals between adjacent shielded wirings. Through holes are evenly opened on the adhesive base layer, and the positions of the through holes and the holes are left and right. phase staggered. In the present invention, there are electromagnetic shielding objects around the signal wiring, which has a high shielding function, thereby improving the anti-interference ability of the signal wiring, avoiding the mutual interference between the signal wiring and the shielding wiring. At the same time, parasitic capacitance occurs.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, in particular to an aluminum substrate. Background technique [0002] At present, there are mainly two types of aluminum substrates. The first is the aluminum substrate using flexible materials as the substrate, and the other is the aluminum substrate using rigid materials as the substrate. Among them, the aluminum substrate using flexible materials as the substrate is generally in the form of Polyimide is used as the bottom plate, and copper foil is attached to the surface as a printed circuit conductor. It has excellent electrical characteristics. Compared with traditional PCBs, FPC has extremely high flexibility, making it naturally suitable for circuits in three-dimensional space. interconnection. Under the premise of meeting high reliability, FPC can save a lot of installation controls, make electronic equipment thinner and smaller, and at the same time have the characteristics of go...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/0218H05K1/115
Inventor 吴瑜
Owner 广德通灵电子有限公司