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Glass package temperature sensor and manufacturing method thereof

A temperature sensor and glass packaging technology, applied in thermometers, thermometer applications, instruments, etc., can solve the problems of equipment not providing a foundation and a better solution, and achieving the effect of improving the utilization rate of silver paste and saving silver paste

Active Publication Date: 2019-09-10
XINGQIN YICHANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] During the bonding process, it is necessary to weld the front and back sides of the chip with a length and width of several millimeters with Dumet wire, and the existing equipment does not provide a foundation
[0006] In addition, how to perfectly fuse the cylindrical glass shell with the internal chip and Dumet wire after inserting the glass shell and ensure that the cylindrical glass shell is elliptical, the existing equipment cannot do this
[0007] From the systematic molding process of straightening, cutting, dipping silver, soldering chips, baking silver, inserting glass tubes and high-temperature molding, the existing technology has not given a good solution for reference

Method used

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  • Glass package temperature sensor and manufacturing method thereof
  • Glass package temperature sensor and manufacturing method thereof
  • Glass package temperature sensor and manufacturing method thereof

Examples

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Embodiment Construction

[0107] Such as Figure 1-4 As shown, a glass-encapsulated temperature sensor includes a chip 1, and a wire 2 is fixed on the left and right sides of the chip 1 by silver paste welding. The wire 2 is a dumet wire, and the diameter of the dumet wire is 0.3m / m. The ends of the chip 1 and the wire 2 are covered with a glass tube 3, and the glass tube 3 is integrated with the chip 1 and the wire 2 after heat melting.

[0108] A glass-encapsulated temperature sensor is processed and manufactured with special equipment. Specifically, the equipment includes a conveying platform 1, on which, from left to rear, there are successively a transfer fixture lowering mechanism 2, a straightening and shearing mechanism 3, a silver dipping mechanism 4, a chip welding mechanism 5, and a silver drying mechanism 6. , Insert glass bulb mechanism 7 and glass sealing forming mechanism 8. The above mechanisms respectively complete Dumet silk thread straightening --> Straightening --> Clamping wire -...

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PUM

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Abstract

The invention discloses a glass package temperature sensor and a manufacturing method thereof. The glass package temperature sensor which is formed by wrapping and fusing glass bulb is made through the steps of wire straightening, straightening, clamping pulling line, cutting, jig transfer, trimming, silver staining, bonding sheet, preheating, silver baking, inserting and sleeving glass tube, pre-heating, high temperature molding, overturning, preheating, high temperature molding and material receiving. According to theglass package temperature sensor and the manufacturing method thereof, theworking efficiencycan be improvedwhen processing is carried out in a reasonable manner.

Description

technical field [0001] The invention relates to the production field of a glass-encapsulated temperature sensor, in particular to a glass-encapsulated temperature sensor and a manufacturing method thereof. Background technique [0002] In the production process of the glass-encapsulated temperature sensor, the following process needs to go through: wire straightening --> straightening --> clamping wire --> cutting --> jig transfer --> cutting --> dipping silver --> Sticking film-->preheating-->baking silver-->inserting glass tube-->preheating-->high temperature forming-->turning over-->preheating-->high temperature forming-->receiving. [0003] The wire pins used in the glass-encapsulated temperature sensor are Dumet wires, and the diameter of the Dumet wires is less than 0.3m / m. The Dumet wires are nickel-iron alloys with copper plating and are generally used in the diode or light bulb (tube) industry. Because the wire is a n...

Claims

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Application Information

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IPC IPC(8): G01K13/00
CPCG01K13/00
Inventor 隋中華
Owner XINGQIN YICHANG ELECTRONICS
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