Carrier surface cleaning device and method

Abstract

The invention provides a carrier surface cleaning device and method. The carrier surface cleaning device comprises a wafer carrier, a chemical mechanical grinding head and a grinding head moving part,wherein a connecting end of the grinding head moving part comprises a rotating disc, the chemical mechanical grinding head rotates at a high speed under the driving of the rotating disc, a chemical cleaning agent spraying pipeline and a chemical cleaning agent recycling pipeline are arranged on the chemical mechanical grinding head, a guide outlet of the chemical cleaning agent spraying pipelineis located in the center of a grinding surface of the chemical mechanical grinding head, a suction inlet of the chemical cleaning agent recycling pipeline is located on the periphery of the grinding surface of the chemical mechanical grinding head, and the chemical cleaning agent spraying pipeline and the chemical cleaning agent recycling pipeline penetrate through the chemical mechanical grindinghead. According to the device, the influence of pollutants on wafer flatness is avoided, the wafer flattening effect during exposure is improved, so that the phenomenon that after photoetching is performed, the pattern loss and the lamination alignment performance are poor is avoided, and the product yield is increased.

Description

technical field [0001] The invention relates to the application of semiconductor photolithography technology, in particular to the structure of components and devices of photolithography exposure equipment, in particular to a device and method for cleaning the surface of a stage. Background technique [0002] In the 20th century, multi-layer metallization technology was introduced into the integrated circuit manufacturing process. This multi-layer metallization technology enables the vertical space of the chip to be effectively used, thus improving the integration of electronic components on the chip. However, when the exposure machine’s crystal When there are impurities on the round stage, the impurities on the wafer stage will aggravate the surface unevenness of the wafer, which will cause a series of problems, such as: causing uneven thickness of photoresist, which in turn leads to limited photolithography , which will cause the wafer to be out of focus, which seriously a...

AI Technical Summary

Problems solved by technology

[0008] In order to solve the deficiencies of the prior art and improve the cleaning effect of the wafer stage of the exposure machine, the object of the present invention is to provide a surface cleaning device and method for the stage to solve the waste of time and insufficient cleaning of the existing wafer stage cleaning method question

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