Automatic wafer testing machine

An automatic testing machine and chip technology, applied in the direction of conveyor objects, transportation and packaging, etc., can solve the problems of increasing labor intensity, unfavorable production efficiency and production capacity, etc., to reduce labor intensity, improve efficiency and production capacity, and realize automated testing Effect

Pending Publication Date: 2019-09-17
范群意
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional wafer testing machines need to use manual loading and unloading, which increases the labor

Method used

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  • Automatic wafer testing machine
  • Automatic wafer testing machine
  • Automatic wafer testing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] reference figure 1 with 2 As shown, this embodiment discloses an automatic wafer tester, which includes a frame 1, a transfer device 3 provided on the frame 1, a tray device 2, a test device 4, and a display device 5. The rack 1 is also provided with an electric control device, which mainly includes a PLC module, which is used to control the sequential actions of each device of the integrated wafer automatic tester, and realize the automatic operation of the wafer test. The display device 5 is configured to display the running status and test results of each device, which is convenient for manual real-time monitoring of the test process.

[0050] Specifically, refer to image 3 , The rack 1 includes a main body 11 and a bearing platform 12 arranged on the upper part of the main body 11, the main body 11 is used to accommodate the electric control device; the bearing platform 12 is used to carry the transfer device 3 and the tray device 2; optionally, The carrying platform ...

Embodiment 2

[0055] This embodiment is to provide a tray device 2 that can be used in the automatic wafer tester in the first embodiment. Specifically, refer to Figure 4 The tray device 2 includes a mounting top plate 21 and a mounting bottom plate 22. Optionally, the mounting top plate 21 and the mounting bottom plate 22 are spaced apart and connected by a connecting rod 23, which is vertically arranged between the mounting top plate 21 and the mounting bottom plate 22. Further, in order to enable the automatic testing machine to test more wafers, each tray device 2 is configured to allow a plurality of trays 100 to be stacked in the vertical direction between the mounting top plate 21 and the mounting bottom plate 22. In the space, the transfer device 3 completes the reciprocating movement of the wafer on the uppermost tray 100 between the tray device 2 and the test device 4 according to the instructions, or completes the empty tray in the test tray device and the empty tray device Trans...

Embodiment 3

[0064] This embodiment is to provide a transfer device 3 that can be used in the wafer automatic tester in the first embodiment. The transfer device 3 is configured to realize the tray 100 between different tray devices 2 and the wafer in the tray device The movement between 2 and the test device 4 completes the reclaiming or unwinding action. Specifically, refer to Figure 7 with Figure 8 , The transfer device 3 includes a first slide rail 311, a first drive assembly 33, a second slide rail 321, a second drive assembly 34, and a nozzle assembly 37. The nozzle assembly 37 includes a nozzle body 373 for directly sucking materials For the disk 100 or wafer, the first drive assembly 33 is configured to drive the nozzle assembly 37 to move along the first slide rail 311, and the second drive assembly 34 is configured to drive the nozzle assembly 37 and the first slide rail 311 integrally along the second slide The rail 321 moves, and the extension directions of the first slide rai...

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PUM

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Abstract

The invention discloses an automatic wafer testing machine, and belongs to the technical field of wafer testing. The automatic wafer testing machine comprises tray devices, a testing device and a transferring device, wherein the multiple tray devices are arranged, the multiple tray devices comprise to-be-tested tray devices and sorting tray devices, the to-be-tested tray devices are configured to carry trays with to-be-tested wafers to be placed thereon, the sorting tray devices are configured to carry trays with tested wafers placed thereon, the transferring device can be used for transferring the to-be-tested wafers on the to-be-tested tray devices to the testing device to complete testing, and the transferring device can also be used for transferring the tested wafers from the testing device to the sorting tray devices. According to the automatic testing machine, the automatic testing of the wafers is realized, the efficiency and the productivity of wafer testing are improved, and the labor intensity of working personnel production is reduced.

Description

Technical field [0001] The invention relates to the technical field of wafer testing, in particular to a wafer automatic testing machine. Background technique [0002] After the wafer is manufactured, the wafer is cut to form a wafer. In order to avoid damage to the wafer during the cutting process and produce unqualified products, it is necessary to conduct a quality test on a single wafer to ensure the product pass rate before chip packaging. Avoid increasing the cost of later repairs. The wafer test is performed using a test board, and the probe on the test board contacts the wafer to complete the program test. Traditional wafer testing machines require manual loading and unloading, which increases the labor intensity of personnel and is not conducive to improving production efficiency and productivity. [0003] Therefore, it is urgent to provide an automatic wafer tester to solve the above problems. Summary of the invention [0004] The purpose of the present invention is to ...

Claims

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Application Information

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IPC IPC(8): B65G47/90B65G47/74
CPCB65G47/74B65G47/901
Inventor 范群意
Owner 范群意
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