Mass transfer head and method for an electronic element

A technology of electronic components and transfer methods, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of LED resource waste, Micro-LED waste, etc., and achieve the effect of avoiding resource waste

Inactive Publication Date: 2019-09-27
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, one pick-up head corresponds to pick up a Micro-LED, the pitch of the pick-up head (that is, the distance between two adjacent pick-up heads) is fixed, and the pitch of the pick-up head is consistent with the pixel pitch of the display pixel on the display panel. However, the Micro-LED pitch on the growth substrate and the transfer substrate is different from

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  • Mass transfer head and method for an electronic element
  • Mass transfer head and method for an electronic element
  • Mass transfer head and method for an electronic element

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Embodiment Construction

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0033] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0034] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a mass transfer head and method for an electronic element, and relates to the technical field of electronic element production. The transfer head comprises a memory alloy substrate and a plurality of electronic element pick-up heads fixed on the first surface of the memory alloy substrate. At the same temperature, the center distances between any two adjacent electronic element pick-up heads are equal; the memory alloy substrate deforms along with the change of temperature; when the temperature rises, the memory alloy substrate stretches, and the center distance between any two adjacent electronic element pick-up heads is increased; when the temperature decreases, the memory alloy substrate is shrunk, and the center distance between any two adjacent electronic element pick-up heads is reduced. The distance between the electronic element pick-up heads fixed on the memory alloy substrate can be adjusted by the adjustment of the temperature. The mass transfer head is flexibly suitable for different Micro-LED pitches and pixel pitches, thereby avoiding the consumption of the Micro-LED resources.

Description

technical field [0001] The invention relates to the technical field of electronic component production, and more specifically, to a mass transfer head and a transfer method for electronic components. Background technique [0002] Micro-LED is a display technology that miniaturizes and matrixes the LED structure, and individually drives and addresses each pixel. Since the brightness, life, contrast, response time, energy consumption, viewing angle and resolution of Micro-LED technology are superior to LCD and OLED technology, it is regarded as a new generation that can surpass OLED and traditional Micro-LED. display technology. However, due to the extremely high efficiency in the packaging process, the 99.9999% yield rate and the need for transfer accuracy within plus or minus 0.5 μm, the size of Micro-LED components is basically less than 50 μm and the number is tens of thousands to several million. A core technical problem that still needs to be overcome in the process of...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L33/00
CPCH01L21/683H01L33/0095
Inventor 符鞠建
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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