The invention discloses a silicon wafer wire cutting machine which comprises a cutting head, a feeding table, a feeding table fixing frame, a wire winding and unwinding tool, a wire drum chamber and a main motor. The feeding table is fixed to the feeding table fixing frame. The cutting head is located below the feeding table. The wire winding and unwinding tool is arranged on one side of the cutting head, and a wire drum chamber is arranged on the other side of the feeding table fixing frame. Mortar nozzles are arranged on the two sides of a cutting guiding wheel, after boxes are fully filled with mortar, the mortar flows out at a constant speed, impact force on the silicon wafer is small, and the mortar on the two sides can be evenly distributed on a wire net. According to the cutting head of the silicon wafer wire cutting machine, the central distance between mounting holes is smaller, the wire net is smaller, stability is higher, wires are not prone to breaking, cutting quality is higher, and production efficiency and the silicon wafer percent of pass are increased.