Unlock instant, AI-driven research and patent intelligence for your innovation.

A radio frequency power supply system, plasma processor and frequency modulation matching method thereof

A radio frequency power supply and plasma technology, which is applied in semiconductor/solid-state device manufacturing, circuits, discharge tubes, etc., can solve the problems of increased cost of plasma processors, inability to achieve effective impedance matching, and variable capacitors that cannot achieve response speed, etc.

Active Publication Date: 2019-11-12
ADVANCED MICRO FAB EQUIP INC CHINA
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of using the movable parts in the matcher for mechanical motion compensation can be applied to applications where the plasma impedance changes slowly, but for plasma impedance that changes rapidly in a very short time, such as a sharp change in impedance that occurs within 1ms , the mechanically driven variable capacitor in the traditional matcher cannot achieve such a response speed, so the effective matching of impedance cannot be achieved
Once it cannot be effectively matched, a large amount of power will be wasted in the incident and reflected circuits, and at the same time, a large amount of redundant reflected current will flow into the RF power supply, which will cause the temperature of the RF power supply to be too high, which will affect the life of the internal electronic components, resulting in frequent replacement of expensive RF power supplies. The cost of using plasma processors has increased significantly

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A radio frequency power supply system, plasma processor and frequency modulation matching method thereof
  • A radio frequency power supply system, plasma processor and frequency modulation matching method thereof
  • A radio frequency power supply system, plasma processor and frequency modulation matching method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0052] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0053] Figure 7 A capacitively coupled plasma processing device proposed by the present invention includes a controller 30 capable of segmented frequency matching, which is connected to two radio frequency power supplies 31 and 32 respectively, and receives outputs from the two radio frequency power supplies ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a radio frequency power supply system, a plasma processor and a frequency modulation matching method thereof, which are applied to a plasma processor with an ultra-low frequency bias radio frequency power source. Including an impedance segmentation frequency matching acquisition step, dividing the low-frequency radio frequency power output cycle into a plurality of impedance matching sections, adjusting the output frequency of the high-frequency radio frequency source in each impedance matching section, and detecting the reflected power of the high-frequency radio frequency power supply, The segment matching frequency of each impedance matching segment is obtained and stored after experiencing one or more low-frequency radio frequency power output cycles. Then, in the frequency conversion matching step, the output frequency of the high-frequency radio frequency power supply is set to change periodically in the above-mentioned stored multiple section matching frequencies, so as to match the characteristic impedance in each impedance matching section.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to a frequency modulation matching method in a plasma processor. Background technique [0002] Vacuum processing equipment is widely used in the semiconductor industry, among which plasma processing equipment and chemical vapor deposition equipment are the most important vacuum processing equipment. Plasma processing equipment generates plasma by means of radio frequency coupling discharge, and then uses plasma for deposition, etching and other processing processes. [0003] Such as figure 1 Shown is a capacitively coupled plasma processing device, including a reaction chamber 100, the reaction chamber includes a conductive base 22, and the base is used as a lower electrode connected to two radio frequency power sources 32, 31, wherein the source radio frequency power source 32 is output through a matching device 2 The high frequency radio frequency power (HF) is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32H01L21/67
CPCH01J37/32091H01J37/32155H01L21/67011H01L21/67069H01J2237/332H01J2237/334H01J37/32183H03H7/40H03H2007/386
Inventor 倪图强徐蕾涂乐义
Owner ADVANCED MICRO FAB EQUIP INC CHINA