A kind of copper foil manufacturing method
A manufacturing method and technology of copper foil, applied in the field of copper foil manufacturing, can solve the problems of poor toughness of copper foil, deformation of copper foil plate, high impurity content of copper plate, etc.
Active Publication Date: 2020-12-22
常州高晶新材料有限公司
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Problems solved by technology
[0003] However, due to the poor toughness of copper foil in the existing process of cutting longer copper foils, if the size to be cut is longer, the copper foil plate after cutting will drop to the ground easily causing deformation of the copper foil plate, and Before cutting, it is directly limited by the limit device at the edge of the copper foil board, which is prone to upward arching, and the cutting is not accurate. At the same time, when the waste copper is melted, due to the different impurities in different copper wires, it is easy to cause the copper plate to be solidified after the same melting. The content of some impurities is high, which affects the production quality of copper foil
Method used
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[0028] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0029] Such as Figure 1-Figure 7 Shown, a kind of copper foil manufacturing method of the present invention, this method comprises the following steps:
[0030] S1: Collect waste copper wires, classify the collected copper wires according to the diameter of the copper wires, and peel off the insulation layer on the surface of the copper wires by a drum stripping machine to obtain copper. By peeling off the insulation layer of the copper wires, the insulation layer The mixing of internal impurities into copper affects the recycling of copper;
[0031] S2: The copper obtained in S1 is dissolved at a high temperature of 1100°C to obtain copper liquid, and the copper liquid is passed through a net made of natural flake graphite as the main raw mater...
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The invention relates to the field of copper foil manufacturing, in particular to a copper foil manufacturing method. A copper foil manufacturing device used in the copper foil manufacturing method comprises a cutting machine, an adjusting mechanism, a driving mechanism, a discharging mechanism, a rolling mechanism and an air guiding mechanism, wherein the driving mechanism drives the rolling mechanism to squeeze a copper foil board on the surface of a cutting machine body while the copper foil board is cut, and thus, the condition that the copper foil board needing to be cut arches and crumples before cutting to cause the inaccuracy of cutting the copper foil board is avoided; a connecting plate is pressed downwards by a pressing plate to realize the cutting of the copper foil board by ablade, and meanwhile the linkage between the rolling mechanism and the air guiding mechanism is realized; further, air in an air pipe expands an air bag; the complete discharging of the copper foil board cut on the surface of the discharging mechanism is realized; and the rolling mechanism is in linkage with the discharging mechanism through the air guiding mechanism, so that the leveling of the copper foil board needing to be cut is realized on the one hand, and the discharging of the cut copper foil board is realized on the other hand.
Description
technical field [0001] The invention relates to the field of copper foil manufacturing, in particular to a copper foil manufacturing method. Background technique [0002] Copper foil is a negative electrolytic material, a thin, continuous layer of metal foil deposited on the base layer of the circuit board, which acts as a conductor for the PCB. It is easy to bond to the insulating layer, accept the printed protective layer, and form a circuit pattern after corrosion. Copper foil has low surface oxygen characteristics and can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. . Mainly used in electromagnetic shielding and antistatic, the conductive copper foil is placed on the substrate surface, combined with the metal substrate, it has excellent conductivity and provides the effect of electromagnetic shielding. [0003] However, due to the poor toughness of copper foil in the existing process of cutting longer ...
Claims
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IPC IPC(8): B21B1/40B21C37/02B26F1/38C22B15/00C22B7/00
CPCB21B1/40B21C37/02B26F1/38C22B15/0056Y02P10/20
Inventor 不公告发明人
Owner 常州高晶新材料有限公司