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Image processing method and device and storage medium

An image processing device and an image processing technology, applied in the field of image processing, can solve the problems of low readout signal consistency, low readout circuit space utilization, etc.

Active Publication Date: 2019-10-08
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the related art, multiple pixel units can only share one readout circuit when one pixel unit includes one photodiode (PD). When one pixel unit includes at least three PDs, one pixel At least 3 PDs in the unit correspond to at least 3 readout circuits respectively, the space utilization rate of the readout circuits is low, and the consistency of the readout signals is low

Method used

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  • Image processing method and device and storage medium
  • Image processing method and device and storage medium
  • Image processing method and device and storage medium

Examples

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no. 1 example

[0037] The first embodiment of the present application proposes an image processing device, figure 2 It is a schematic structural diagram of an image processing device according to an embodiment of the present application, such as figure 2 As shown, the image processing device 200 may include:

[0038] A pixel unit 201, configured to convert an optical signal into an electrical signal corresponding to a single pixel; the pixel unit 201 includes at least three PDs;

[0039] The readout circuit 202 is used for sequentially reading out electrical signals of at least three PDs in the pixel unit.

[0040] In the embodiment of the present application, for the specific implementation of converting an optical signal into an electrical signal corresponding to a single pixel, the monochromatic light absorbed by at least three PDs included in a single pixel undergoes photoelectric conversion in the PD depletion region.

[0041] The readout circuit may specifically include a selection...

no. 2 example

[0054] On the basis of the first embodiment of the present application, further illustrations are given below through specific application examples.

[0055] In the image processing device of this application example, three cylindrical PD columns with different diameters are arranged in each sub-wavelength pixel unit, which respectively absorb light of three different wavelengths of R, G, and B. Due to the optical resonance of the PD column, the optical density of states on the PD column is greatly enhanced, thereby improving the absorption of light in the three bands of R, G, and B. After the photons are converted into electrons, the electrical signals of the R, G, and B channels are respectively read out through the readout circuit, and the electrical signals are converted into digital signals for storage in the cache to obtain an unprocessed RAW image.

[0056] pass below image 3 Describe the arrangement of PD columns in a single pixel unit of the sub-wavelength pixel col...

no. 3 example

[0065] An embodiment of the present application provides an image processing method, which is applied to an image processing device, and the image processing device includes a pixel unit and a readout circuit, such as Image 6 As shown, the method may include:

[0066] Step 601: Convert the optical signal into an electrical signal corresponding to a single pixel through a pixel unit; the pixel unit includes at least three photodiodes PD.

[0067] Step 602: sequentially select and read out electrical signals of at least three PDs in the pixel unit through a readout circuit.

[0068] It can be seen that since the pixel unit is a photoelectric conversion circuit corresponding to a single pixel, and the pixel unit includes at least three PDs, the readout circuit can sequentially read out the electrical signals of at least three PDs in the pixel unit, so it can pass the same The readout circuit realizes the readout of at least three PD power-up signals in the pixel unit, and furth...

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Abstract

The embodiment of the invention provides an image processing device and method and a storage medium, and the device comprises a pixel unit which is used for converting an optical signal into an electric signal corresponding to a single pixel, wherein the pixel unit comprises at least three PDs; and a reading circuit which is used for sequentially reading the electric signals of at least three PDsin the pixel unit. Therefore, the pixel unit is the photoelectric conversion circuit corresponding to the single pixel, the pixel unit comprises the at least three PDs, and the electric signals of theat least three PDs in the pixel unit can be read out in sequence through the reading circuit, so that the reading of the electric signals on the at least three PDs in the pixel unit can be realized through the same reading circuit, and the space utilization rate of the reading circuit of the image processing device is improved.

Description

technical field [0001] The present application relates to image processing technology, and in particular to an image processing method, device and storage medium. Background technique [0002] Complementary Metal Oxide Semiconductor Image Sensor (CIS) is composed of a pixel unit, an analog circuit, a readout circuit and a buffer, etc., and the CIS signal readout method in an existing mobile terminal is: shared by multiple pixel units A readout circuit, at most 8 pixel units can share one readout circuit at present. [0003] However, in the related art, multiple pixel units can only share one readout circuit when one pixel unit includes one photodiode (PD). When one pixel unit includes at least three PDs, one pixel The at least 3 PDs in the unit correspond to at least 3 readout circuits respectively, and the space utilization rate of the readout circuits is low, and the consistency of the readout signals is low. Contents of the invention [0004] Embodiments of the presen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/378H04N5/369
CPCH04N25/70H04N25/75
Inventor 杨鑫
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD